Deposition: Physical Vapor Deposition (PVD) Techniques

This lecture covers Physical Vapor Deposition (PVD) techniques, including evaporation and sputtering, used for depositing thin films in nanofabrication. It explains the process of vaporizing materials from a source to solidify on a substrate, the importance of directional deposition, and issues like metal diffusion, stress in thin films, and contamination. The lift-off process for patterning materials without etching is also discussed, along with the challenges of achieving proper metal contact. Various methods such as reactive sputtering and lift-off techniques are explored, emphasizing the critical factors for successful deposition processes.