Lecture
This lecture covers the different types of Chemical Vapor Deposition (CVD) processes, including Atmospheric Pressure CVD (APCVD), Sub-atmospheric Pressure CVD (SACVD), Low-pressure CVD (LPCVD), and Ultrahigh Vacuum CVD (UHV/CVD). It explains the impact of operating pressure on film growth rates, gas consumption, and film uniformity. The lecture also delves into Plasma-enhanced CVD (PECVD) and Metal-organic CVD (MOCVD) techniques, highlighting their unique configurations and applications in Micro and Nanofabrication (MEMS). The importance of temperature control, gas diffusion, and gas-phase reactions in CVD processes is emphasized, along with the role of plasma in enhancing film deposition rates and reducing activation energy.