MEMSMEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.
Compressive strengthIn mechanics, compressive strength (or compression strength) is the capacity of a material or structure to withstand loads tending to reduce size (as opposed to tensile strength which withstands loads tending to elongate). In other words, compressive strength resists compression (being pushed together), whereas tensile strength resists tension (being pulled apart). In the study of strength of materials, tensile strength, compressive strength, and shear strength can be analyzed independently.
Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
Shock (mechanics)A mechanical or physical shock is a sudden acceleration caused, for example, by impact, drop, kick, earthquake, or explosion. Shock is a transient physical excitation. Shock describes matter subject to extreme rates of force with respect to time. Shock is a vector that has units of an acceleration (rate of change of velocity). The unit g (or g) represents multiples of the acceleration of gravity and is conventionally used. A shock pulse can be characterised by its peak acceleration, the duration, and the shape of the shock pulse (half sine, triangular, trapezoidal, etc.
Radiation hardeningRadiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation (particle radiation and high-energy electromagnetic radiation), especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
Wafer (electronics)In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning.
Noise, vibration, and harshnessNoise, vibration, and harshness (NVH), also known as noise and vibration (N&V), is the study and modification of the noise and vibration characteristics of vehicles, particularly cars and trucks. While noise and vibration can be readily measured, harshness is a subjective quality, and is measured either via jury evaluations, or with analytical tools that can provide results reflecting human subjective impressions. The latter tools belong to the field psychoacoustics.
Strength of materialsThe field of strength of materials (also called mechanics of materials) typically refers to various methods of calculating the stresses and strains in structural members, such as beams, columns, and shafts. The methods employed to predict the response of a structure under loading and its susceptibility to various failure modes takes into account the properties of the materials such as its yield strength, ultimate strength, Young's modulus, and Poisson's ratio.
Printed electronicsPrinted electronics is a set of printing methods used to create electrical devices on various substrates. Printing typically uses common printing equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography, and inkjet. By electronic-industry standards, these are low-cost processes. Electrically functional electronic or optical inks are deposited on the substrate, creating active or passive devices, such as thin film transistors; capacitors; coils; resistors.
Atmosphere of JupiterThe atmosphere of Jupiter is the largest planetary atmosphere in the Solar System. It is mostly made of molecular hydrogen and helium in roughly solar proportions; other chemical compounds are present only in small amounts and include methane, ammonia, hydrogen sulfide, and water. Although water is thought to reside deep in the atmosphere, its directly measured concentration is very low. The nitrogen, sulfur, and noble gas abundances in Jupiter's atmosphere exceed solar values by a factor of about three.
