Publication
A physical model for the design of the power distribution networks in three-dimensional integrated circuits is proposed. The tradeoffs among the different design parameters are specified and analyzed. Different case studies are explored, indicating that smaller and denser TSVs can deliver power more efficiently as compared to larger and coarsely distributed TSVs. The interplay between the TSV count and the intra-plane power distribution network in reducing the power supply noise is also shown.
Sandro Carrara, Diego Ghezzi, Gian Luca Barbruni
David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Alexandre Sébastien Julien Levisse, Halima Najibi