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Fast Thermal Simulation of 2D/3D Integrated Circuits Exploiting Neural Networks and GPUs

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Fast Thermal Simulation of 2D/3D Integrated Circuits Exploiting Neural Networks and GPUs

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Thermal Issues in Deep Sub-Micron FDSOI Circuits

Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs

A semi-analytical approach for optimized design of microchannel liquid-cooled ICs

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Thermal Simulation of Liquid-Cooled Integrated Circuits

STEAM: a fast compact thermal model for two-phase cooling of integrated circuits

Accelerating Thermal Simulations of 3D ICs with Liquid Cooling using Neural Networks

Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

A semi-analytical approach for optimized design of microchannel liquid-cooled ICs

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Accelerating Thermal Simulations of 3D ICs with Liquid Cooling using Neural Networks

Thermal Issues in Deep Sub-Micron FDSOI Circuits

A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Thermal Simulation of Liquid-Cooled Integrated Circuits

STEAM: a fast compact thermal model for two-phase cooling of integrated circuits