Lattice-based cryptographyLattice-based cryptography is the generic term for constructions of cryptographic primitives that involve lattices, either in the construction itself or in the security proof. Lattice-based constructions are currently important candidates for post-quantum cryptography. Unlike more widely used and known public-key schemes such as the RSA, Diffie-Hellman or elliptic-curve cryptosystems — which could, theoretically, be defeated using Shor's algorithm on a quantum computer — some lattice-based constructions appear to be resistant to attack by both classical and quantum computers.
Lattice problemIn computer science, lattice problems are a class of optimization problems related to mathematical objects called lattices. The conjectured intractability of such problems is central to the construction of secure lattice-based cryptosystems: Lattice problems are an example of NP-hard problems which have been shown to be average-case hard, providing a test case for the security of cryptographic algorithms. In addition, some lattice problems which are worst-case hard can be used as a basis for extremely secure cryptographic schemes.
Ideal latticeIn discrete mathematics, ideal lattices are a special class of lattices and a generalization of cyclic lattices. Ideal lattices naturally occur in many parts of number theory, but also in other areas. In particular, they have a significant place in cryptography. Micciancio defined a generalization of cyclic lattices as ideal lattices. They can be used in cryptosystems to decrease by a square root the number of parameters necessary to describe a lattice, making them more efficient.
ARM architecture familyARM (stylised in lowercase as arm, formerly an acronym for Advanced RISC Machines and originally Acorn RISC Machine) is a family of reduced instruction set computer (RISC) instruction set architectures for computer processors, configured for various environments. Arm Ltd. develops the architectures and licenses them to other companies, who design their own products that implement one or more of those architectures, including system on a chip (SoC) and system on module (SOM) designs, that incorporate different components such as memory, interfaces, and radios.
BeamformingBeamforming or spatial filtering is a signal processing technique used in sensor arrays for directional signal transmission or reception. This is achieved by combining elements in an antenna array in such a way that signals at particular angles experience constructive interference while others experience destructive interference. Beamforming can be used at both the transmitting and receiving ends in order to achieve spatial selectivity. The improvement compared with omnidirectional reception/transmission is known as the directivity of the array.
Very Large Scale IntegrationVery large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit (Metal Oxide Semiconductor) chips were developed and then widely adopted, enabling complex semiconductor and telecommunication technologies. The microprocessor and memory chips are VLSI devices. Before the introduction of VLSI technology, most ICs had a limited set of functions they could perform.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Cognitive radioA cognitive radio (CR) is a radio that can be programmed and configured dynamically to use the best wireless channels in its vicinity to avoid user interference and congestion. Such a radio automatically detects available channels in wireless spectrum, then accordingly changes its transmission or reception parameters to allow more concurrent wireless communications in a given spectrum band at one location. This process is a form of dynamic spectrum management.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Multi-project wafer serviceMulti-project chip (MPC), and multi-project wafer (MPW) semiconductor manufacturing arrangements allow customers to share mask and microelectronics wafer fabrication cost between several designs or projects. With the MPC arrangement, one chip is a combination of several designs and this combined chip is then repeated all over the wafer during the manufacturing. MPC arrangement produces typically roughly equal number of chip designs per wafer.
