Publication

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Related publications (73)

A modular multiple frequency inductive link to wirelessly power multiple miniaturized implants

Sandro Carrara, Diego Ghezzi, Gian Luca Barbruni

A modular multiple frequency coils inductive link system to wirelessly provide power for at least a medical implant at an output of a receiving coil, whereby the receiving coil is configured to be implanted in an organism. The modular multiple frequency co ...

2024

Graph generative deep learning models with an application to circuit topologies

Igor Krawczuk

Modern integrated circuits are tiny yet incredibly complex technological artifacts, composed of millions and billions of individual structures working in unison.Managing their complexity and facilitating their design drove part of the co-evolution of moder ...

EPFL2024

The 2024 Magnonics Roadmap

Dirk Grundler, Thomas Yu, Ping Che, Qi Wang, Wei Zhang, Benedetta Flebus

Magnonics is a research field that has gained an increasing interest in both the fundamental and applied sciences in recent years. This field aims to explore and functionalize collective spin excitations in magnetically ordered materials for modern informa ...

2024

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

Remco Franciscus Peter van Erp

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

EPFL2022

Low-Power Design of Digital VLSI Circuits around the Point of First Failure

Andrea Bonetti

As an increase of intelligent and self-powered devices is forecasted for our future everyday life, the implementation of energy-autonomous devices that can wirelessly communicate data from sensors is crucial. Even though techniques such as voltage scaling ...

EPFL2019

System Design and Advanced Circuit Techniques for Bi-Directional Brain-Machine Interfaces

Wen-Yang Hsu

Bi-directional brain-machine interfaces (BBMIs) that can capture electrophysiological signals and provide feedback through electrical stimulation are emerging tools with various applica-tions in fundamental neuroscience research as well as in clinical trea ...

EPFL2018

Automated Integration of Dual-Edge Clocking for Low-Power Operation in Nanometer Nodes

Andreas Peter Burg, Adam Shmuel Teman, Andrea Bonetti, Nicholas Alexander Preyss

Clocking power, including both clock distribution and registers, has long been one of the primary factors in the total power consumption of many digital systems. One straightforward approach to reduce this power consumption is to apply dual-edge-triggered ...

Association for Computing Machinery2017

Design Techniques for Ultra High Frequency Clock Generation in 28 nm FDSOI Technology

Hasene Gülperi Özsema

Twentieth century has been the golden age of semiconductor industry by achieving a high level of growth as a courtesy of developments in fabrication techniques and downscaling of the technology. Since the downscaling in current lithography technology is re ...

EPFL2017

Monolithic technology for silicon nanowires in high-topography architectures

Yusuf Leblebici, Mohammad Nasr Esfahani, Mustafa Yilmaz

Integration of silicon nanowires (Si NWs) in three-dimensional (3D) devices including integrated circuits (ICs) and microelectromechanical systems (MEMS) leads to enhanced functionality and performance in diverse applications. The immediate challenge to th ...

Elsevier2017

Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications

Mikhail Asiatici, Göran Stemme

Through silicon vias (TSVs) are key enablers of 3-D integration technologies which, by vertically stacking and interconnecting multiple chips, achieve higher performances, lower power, and a smaller footprint. Copper is the most commonly used conductor to ...

Institute of Electrical and Electronics Engineers2017

Graph Chatbot

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.