Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations
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This paper presents a circuit-level design and analysis of high-data-rate 3D serial vertical links which exploit the high bandwidth provided by TSV technology. As most of the existing TSVs consume a large amount of die area, the serial configuration can sa ...
An efficient communications apparatus is described for a vector signaling code to transport data and optionally a clocking signal between integrated circuit devices. Methods of designing such apparatus and their associated codes based on a new metric herei ...
During the last decades, the usage of silicon photodetectors, both as stand-alone sensor or integrated in arrays, grew tremendously. They are now found in almost any application and any market range, from leisure products to high-end scientific apparatuses ...
Substantial downscaling of the feature size in current CMOS technology has confronted digital designers with serious challenges including short channel effect and high amount of leakage power. To address these problems, emerging nano-devices, e.g., Silicon ...
An efficient communications apparatus is described for a vector signaling code to transport data and optionally a clocking signal between integrated circuit devices. Methods of designing such apparatus and their associated codes based on a new metric herei ...
Orthogonal differential vector signaling codes are described which support encoded sub-channels allowing transport of distinct but temporally aligned data and clocking signals over the same transport medium. Embodiments providing enhanced LPDDR interfaces ...
This paper presents a high-voltage, high-current implantable cortical stimulation integrated circuit aiming at supporting rehabilitation of patients suffering from stroke. In this context, a large area of the motor cortex needs to be stimulated, requiring ...
Safety requirements for modern automotive electronics call for more and more robust power integrated circuits. The mixed-signal IC design flow alone is often no longer capable of tracking possible design failures in complex Smart Power integrated circuits ...
Self-heating effects became more prominent with the introduction of the modern devices like FDSOI and low thermal conductivity materials such as SiO2. Consequently, the design of high speed digital circuits which are the time-critical blocks of high perfor ...
Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuit ...