Publication

Two-Phase Flow Boiling in a Single Layer of Future High-Performance 3D Stacked Computer Chips

Related publications (36)

About
Privacy
Disclaimer

Graph Chatbot

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.

Two-Phase Flow Boiling in a Single Layer of Future High-Performance 3D Stacked Computer Chips

Graph Chatbot

Chat with Graph Search

Extension of GeN-Foam to modeling of boiling water and validation against the OECD/NRC PSBT benchmark

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

Flow Boiling of Carbon Dioxide at Different Channel Orientations for the Thermal Management of Future Detector Technologies at the High-Luminosity Large Hadron Collider at CERN

A parametric study on pool boiling heat transfer and critical heat flux on structured surfaces with artificial cavities

Thermal management of components for high energy physics experiments and space applications

Simulation and experimental validation of pulsating heat pipes

Experimental Performance of Completely Passive Single and Recirculating Loop Thermosyphon Cooling Systems using Low GWP R1234ze and R1234yf

Experimental characterisation of the thermohydraulic performance of a micro-pin fin evaporator: Heat transfer, flow visualization and modelling

Two-phase operational maps, pressure drop, and heat transfer for flow boiling of R236fa in a micro-pin fin evaporator

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator