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Two-Phase Flow Boiling in a Single Layer of Future High-Performance 3D Stacked Computer Chips

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Extension of GeN-Foam to modeling of boiling water and validation against the OECD/NRC PSBT benchmark

Carlo Fiorina, Stefan Radman, Ran Zhang, Hao Qin

The OpenFOAM-based GeN-Foam solver has recently been extended to allow simulating water boiling based on a porous-medium approach. This paper describes such extension and preliminarily validates it based on the OECD/NRC PSBT benchmark. Three benchmark exer ...

ELSEVIER SCIENCE SA2023

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

EPFL2022

Flow Boiling of Carbon Dioxide at Different Channel Orientations for the Thermal Management of Future Detector Technologies at the High-Luminosity Large Hadron Collider at CERN

David Schmid

The global warming potential (GWP) of working fluids in thermodynamic cycles and their environmental impact have been gaining considerable attention within the recent years. The global objectives on climate protection are becoming increasingly ambitious, w ...

EPFL2022

Emerging applications in new generation electronic devices require effective heat removal and thermal man-agement. In this regard, boiling is a phase change phenomenon capable of dissipating a large amount of heat compared to the sensible heat. In this stu ...

PERGAMON-ELSEVIER SCIENCE LTD2022

Thermal management of components for high energy physics experiments and space applications

Timothée Robert Sophus Frei

High-energy physics (HEP) experiments and space missions share a common challenge: thermal management in harsh environments. The severe constraints in both fields make cooling of electronic components a major design concern. This thesis aims to develop hig ...

EPFL2021

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The one-dimensional transient numerical code of JJ Cooling Innovation has been significantly improved to simulate the thermal/hydraulic performance of pulsating heat pipes (PHPs). Using a mechanistic approach, the liquid slug and vapor plug flows and their ...

PERGAMON-ELSEVIER SCIENCE LTD2021

Experimental Performance of Completely Passive Single and Recirculating Loop Thermosyphon Cooling Systems using Low GWP R1234ze and R1234yf

John Richard Thome

This paper proposes a novel concept for a loop thermosyphon cooling system, designed for the transistor module of a transformer. The thermosyphon uses a free convection cooled condenser, making the system completely passive, i.e. no energy consumption is n ...

IEEE2019

The global tendency towards miniaturization driven by the microelectronics industry is pushing system density and packaging towards unprecedented values of thermal design power, with a dramatic reduction of the surface area of the devices. Vertical integra ...

EPFL2018

Two-phase operational maps, pressure drop, and heat transfer for flow boiling of R236fa in a micro-pin fin evaporator

John Richard Thome, Navid Borhani, Mirco Magnini, Chiara Falsetti, Hamideh Jafarpoorchekab

Cooling the new generation of 3D high power electronic chips is one of the leading challenges in microelectronics, as it is a key to achieve high computational performance at lower cooling system power consumption, thus reducing the operating cost. Two-pha ...

Pergamon-Elsevier Science Ltd2017

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The development of newer and more efficient cooling techniques to sustain the increasing power density of high-performance computing systems is becoming one of the major challenges in the development of microelectronics. In this framework, two-phase coolin ...

Asme2017