A 3-D coupled hydromechanical granular model for simulating the constitutive behavior of metallic alloys during solidification
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Interest in innovative construction processes such as 3D concrete printing (i.e. digital construction), is growing rapidly both in academia and industry. Processing conventional geopolymer mixes, in which alkaline solutions are used for activation, could b ...
To reveal the operating mechanisms of plastic deformation in an FCC high-entropy alloy, the activation volumes in CrMnFeCoNi have been measured as a function of plastic strain and temperature between 77 K and 423 K using repeated load relaxation experiment ...
Nanocrystalline (NC) metals have attracted widespread interest in materials science due to their high strength compared to coarse-grained counterparts. It is well know that during uniaxial deformation, the stress-strain behaviour exhibits an extraordinary ...
The plastic deformation of small-scale face-centered cubic metals exhibits intermittent slip burst events that appear on stress-strain curves as sudden strain jumps and/or load drops. These events are generally attributed to the avalanche-like cooperative ...
Laser powder bed fusion (LPBF) is a powder-based additive manufacturing (AM) technique, which shows great potential in the production of complex-shaped parts with unprecedented design freedom. In addition, it allows for an active manipulation of the micros ...
Model-free data-driven computational mechanics (DDCM) is a new paradigm for simulations in solid mechanics. The modeling step associated to the definition of a material constitutive law is circumvented through the introduction of an abstract phase space in ...
Most of industrial hot deformation processes are performed in variable conditions where the strain rate and/or deformation temperature are not constant. In this work, hot compression tests in both constant and varying strain rate conditions were performed ...
Microcellular open-cell metal foams with pores of 75 or 400 pm in diameter and made of pure Al or Al-2 wt% Mg are tested in compression. The aluminum foam exhibits a typical smooth plastic flow and a positive strain rate sensitivity, whereas plastic instab ...
Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...
In this study, the hot deformation behavior of an Al-1% Mg alloy with very coarse initial grain size was investigated in terms of flow stress evolution and grain refinement mechanism. The large grain size was employed to study the traditional continuous dy ...