XeonXeon (ˈziːɒn ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture.
Mass fluxIn physics and engineering, mass flux is the rate of mass flow. Its SI units are kg m−2 s−1. The common symbols are j, J, q, Q, φ, or Φ (Greek lower or capital Phi), sometimes with subscript m to indicate mass is the flowing quantity. Mass flux can also refer to an alternate form of flux in Fick's law that includes the molecular mass, or in Darcy's law that includes the mass density. Sometimes the defining equation for mass flux in this article is used interchangeably with the defining equation in mass flow rate.
Superscalar processorA superscalar processor is a CPU that implements a form of parallelism called instruction-level parallelism within a single processor. In contrast to a scalar processor, which can execute at most one single instruction per clock cycle, a superscalar processor can execute more than one instruction during a clock cycle by simultaneously dispatching multiple instructions to different execution units on the processor. It therefore allows more throughput (the number of instructions that can be executed in a unit of time) than would otherwise be possible at a given clock rate.
Radiator (engine cooling)Radiators are heat exchangers used for cooling internal combustion engines, mainly in automobiles but also in piston-engined aircraft, railway locomotives, motorcycles, stationary generating plant or any similar use of such an engine. Internal combustion engines are often cooled by circulating a liquid called engine coolant through the engine block, and cylinder head where it is heated, then through a radiator where it loses heat to the atmosphere, and then returned to the engine.
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
Heat pump and refrigeration cycleThermodynamic heat pump cycles or refrigeration cycles are the conceptual and mathematical models for heat pump, air conditioning and refrigeration systems. A heat pump is a mechanical system that allows for the transmission of heat from one location (the "source") at a lower temperature to another location (the "sink" or "heat sink") at a higher temperature. Thus a heat pump may be thought of as a "heater" if the objective is to warm the heat sink (as when warming the inside of a home on a cold day), or a "refrigerator" or “cooler” if the objective is to cool the heat source (as in the normal operation of a freezer).
Working fluidFor fluid power, a working fluid is a gas or liquid that primarily transfers force, motion, or mechanical energy. In hydraulics, water or hydraulic fluid transfers force between hydraulic components such as hydraulic pumps, hydraulic cylinders, and hydraulic motors that are assembled into hydraulic machinery, hydraulic drive systems, etc. In pneumatics, the working fluid is air or another gas which transfers force between pneumatic components such as compressors, vacuum pumps, pneumatic cylinders, and pneumatic motors.
Chip carrierIn electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large. Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is "flat pack".
Pumpable ice technologyPumpable ice technology (PIT) uses thin liquids, with the cooling capacity of ice. Pumpable ice is typically a slurry of ice crystals or particles ranging from 5 micrometers to 1 cm in diameter and transported in brine, seawater, food liquid, or gas bubbles of air, ozone, or carbon dioxide. Beyond generic terms, such as pumpable, jelly, or slurry ice, there are many trademark names for such coolant, like "Deepchill", “Beluga”, “optim”, “flow”, “fluid”, “jel”, “binary”, “liquid”, “maxim”, “whipped”, and “bubble slurry” ice.
Mass flow rateIn physics and engineering, mass flow rate is the mass of a substance which passes per unit of time. Its unit is kilogram per second in SI units, and slug per second or pound per second in US customary units. The common symbol is (ṁ, pronounced "m-dot"), although sometimes μ (Greek lowercase mu) is used. Sometimes, mass flow rate is termed mass flux or mass current, see for example Schaum's Outline of Fluid Mechanics. In this article, the (more intuitive) definition is used. Mass flow rate is defined by the limit: i.
