Linear integrated circuitA linear integrated circuit or analog chip is a set of miniature electronic analog circuits formed on a single piece of semiconductor material. The voltage and current at specified points in the circuits of analog chips vary continuously over time. In contrast, digital chips only assign meaning to voltages or currents at discrete levels. In addition to transistors, analog chips often include a larger number of passive elements (capacitors, resistors, and inductors) than digital chips.
EvaporatorAn evaporator is a device used to turn a liquid into a gas. Some air conditioners and refrigerators use compressed liquids with a low boiling point that vaporizes within the system to cool it, whilst emitting the thermal energy into its surroundings. Evaporators are often used to concentrate a solution. One example is the climbing/falling film plate evaporator, which is used to make condensed milk. Similarly, reduction (cooking) is a process of evaporating liquids from a solution to produce a "reduced" food product, such as wine reduction.
Integrated circuit designIntegrated circuit design, or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography. IC design can be divided into the broad categories of digital and analog IC design. Digital IC design is to produce components such as microprocessors, FPGAs, memories (RAM, ROM, and flash) and digital ASICs.
Packaging and labelingPackaging is the science, art and technology of enclosing or protecting products for distribution, storage, sale, and use. Packaging also refers to the process of designing, evaluating, and producing packages. Packaging can be described as a coordinated system of preparing goods for transport, warehousing, logistics, sale, and end use. Packaging contains, protects, preserves, transports, informs, and sells. In many countries it is fully integrated into government, business, institutional, industrial, and personal use.
FluxFlux describes any effect that appears to pass or travel (whether it actually moves or not) through a surface or substance. Flux is a concept in applied mathematics and vector calculus which has many applications to physics. For transport phenomena, flux is a vector quantity, describing the magnitude and direction of the flow of a substance or property. In vector calculus flux is a scalar quantity, defined as the surface integral of the perpendicular component of a vector field over a surface.
Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
Critical heat fluxIn the study of heat transfer, critical heat flux (CHF) is the heat flux at which boiling ceases to be an effective form of transferring heat from a solid surface to a liquid. Boiling systems are those in which liquid coolant absorbs energy from a heated solid surface and undergoes a change in phase. In flow boiling systems, the saturated fluid progresses through a series of flow regimes as vapor quality is increased. In systems that utilize boiling, the heat transfer rate is significantly higher than if the fluid were a single phase (i.
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
Thermal contact conductanceIn physics, thermal contact conductance is the study of heat conduction between solid or liquid bodies in thermal contact. The thermal contact conductance coefficient, , is a property indicating the thermal conductivity, or ability to conduct heat, between two bodies in contact. The inverse of this property is termed thermal contact resistance. When two solid bodies come in contact, such as A and B in Figure 1, heat flows from the hotter body to the colder body.
Transistor countThe transistor count is the number of transistors in an electronic device (typically on a single substrate or "chip"). It is the most common measure of integrated circuit complexity (although the majority of transistors in modern microprocessors are contained in the cache memories, which consist mostly of the same memory cell circuits replicated many times). The rate at which MOS transistor counts have increased generally follows Moore's law, which observed that the transistor count doubles approximately every two years.
