Publications related to Exploring information retrieval using image sparse representations

Compact Modeling of Charge Transfer in Pinned Photodiodes for CMOS Image Sensors

Christian Enz, Farzan Jazaeri, Assim Boukhayma, Raffaele Capoccia

In this paper, we propose a physics-based compact model of the pinned photodiode (PPD) combined with the transfer gate. A set of analytical expressions is derived for the 2-D electrostatic profile, the PPD capacitance, and the charge transfer current. The ...

2019

Full SPICE Simulation of a CMOS Active Pixel Sensor with Generalized Devices

Jean-Michel Sallese, Chiara Rossi

We present SPICE simulations of a CMOS APS pixel element consisting of the optical sensor and the circuit. The photodiode is simulated at the physics level by means of the so-called generalized devices, without any predefined compact model. Conversely, reg ...

IEEE2019

Single-photon avalanche diode imagers in biophotonics: review and outlook

Edoardo Charbon, Claudio Bruschini, Ivan Michel Antolovic, Harald Arjan Robert Homulle, Samuel Burri

Single-photon avalanche diode (SPAD) arrays are solid-state detectors that offer imaging capabilities at the level of individual photons, with unparalleled photon counting and time-resolved performance. This fascinating technology has progressed at a very ...

2019

A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology

Edoardo Charbon, Myung Jae Lee, Preethi Padmanabhan, Augusto Ronchini Ximenes

This article introduces a modular, direct time-of-flight (TOF) depth sensor. Each module is digitally synthesized and features a 2

\times

(8

\times

8) single-photon avalanche diode (SPAD) pixel array, an edge-sensitive decision tree, a shared time-to ...

2019

Energy-Efficient Motion-Triggered IoT CMOS Image Sensor With Capacitor Array-Assisted Charge-Injection SAR ADC

Kyojin Choo, Li Xu

We propose a low-power image sensor with a motion-based triggering feature for the Internet of Things (IoT) applications. The sensor supports the near-pixel [within analog-to-digital converter (ADC)] motion-detection mode run on a heavily subsampled frame ...

IEEE2019

High Speed SAR ADC Architectures in 28nm FDSOI CMOS

Mustafa Kilic

The demand on high speed Analog to Digital Converters (ADCs) has increased considerably the last years. From communications circuit to high speed oscilloscopes, Giga Samples per second (GS/s) ADCs are requested. With the scaling of the CMOS technology, des ...

EPFL2019

PIRM2018 Challenge on Spectral Image Super-Resolution: Methods and Results

Sabine Süsstrunk, Tong Zhang, Dong Liu, Ruofan Zhou, Fayez Lahoud, Radu Timofte, Chang Chen, Soumik Sarkar

In this paper, we describe the Perceptual Image Restoration and Manipulation (PIRM) workshop challenge on spectral image super-resolution, motivate its structure and conclude on results obtained by the participants. The challenge is one of the first of its ...

SPRINGER INTERNATIONAL PUBLISHING AG2019

A 30-frames/s, 252 x 144 SPAD Flash LiDAR With 1728 Dual-Clock 48.8-ps TDCs, and Pixel-Wise Integrated Histogramming

Edoardo Charbon, Ivan Michel Antolovic, Chunmin Zhang, Scott Anthony Lindner, Juan Mata Pavia, Martin Wolf

A 252 x 144 single-photon avalanche diode (SPAD) pixel sensor, called Ocelot, is reported for light detection and ranging (LiDAR). The sensor, fabricated in the 180-nm CMOS technology, features 1728 12-bit time-to-digital converters (TDCs) with 48.8-ps res ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2019

Oscillator arrangement for time-to-digital converter for large array of time-of-flight image sensor devices

Edoardo Charbon, Preethi Padmanabhan, Augusto Ronchini Ximenes

An oscillator arrangement for time-to-digital converters for a 3D image sensor device includes a plurality of oscillators arranged as an array each oscillator being associated to one time-to-digital converter, and at least one coupling unit respectively ar ...

2019

Fully automated gridding reconstruction for non-Cartesian x-space magnetic particle imaging

Ahmet Alacaoglu

Magnetic particle imaging (MPI) is a fast emerging biomedical imaging modality that exploits the nonlinear response of superparamagnetic iron oxide (SPIO) nanoparticles to image their spatial distribution. Previously, various scanning trajectories were ana ...

2019

Exploring information retrieval using image sparse representations

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Compact Modeling of Charge Transfer in Pinned Photodiodes for CMOS Image Sensors

Full SPICE Simulation of a CMOS Active Pixel Sensor with Generalized Devices

Single-photon avalanche diode imagers in biophotonics: review and outlook

A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology

Energy-Efficient Motion-Triggered IoT CMOS Image Sensor With Capacitor Array-Assisted Charge-Injection SAR ADC

High Speed SAR ADC Architectures in 28nm FDSOI CMOS

PIRM2018 Challenge on Spectral Image Super-Resolution: Methods and Results

A 30-frames/s, 252 x 144 SPAD Flash LiDAR With 1728 Dual-Clock 48.8-ps TDCs, and Pixel-Wise Integrated Histogramming

Oscillator arrangement for time-to-digital converter for large array of time-of-flight image sensor devices

Fully automated gridding reconstruction for non-Cartesian x-space magnetic particle imaging

Compact Modeling of Charge Transfer in Pinned Photodiodes for CMOS Image Sensors

Energy-Efficient Motion-Triggered IoT CMOS Image Sensor With Capacitor Array-Assisted Charge-Injection SAR ADC

PIRM2018 Challenge on Spectral Image Super-Resolution: Methods and Results

Oscillator arrangement for time-to-digital converter for large array of time-of-flight image sensor devices

A 30-frames/s, 252 x 144 SPAD Flash LiDAR With 1728 Dual-Clock 48.8-ps TDCs, and Pixel-Wise Integrated Histogramming

Full SPICE Simulation of a CMOS Active Pixel Sensor with Generalized Devices

Single-photon avalanche diode imagers in biophotonics: review and outlook

Fully automated gridding reconstruction for non-Cartesian x-space magnetic particle imaging

High Speed SAR ADC Architectures in 28nm FDSOI CMOS

A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology