Suspended micro-resonator fabrication: fusion bonding of Silicon Nitride interfaces
Graph Chatbot
Chat with Graph Search
Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.
DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.
Resonators for time and frequency reference applications are essential elements found in most electronic devices surrounding us. The continuous minimization and ubiquitous distribution of such electronic devices and circuits demands for resonators of small ...
ABSTRACT The mechanical stability of silicon MEMS dies is strongly influenced by the microfabrication processes, especially grinding, dicing and etching, which leave characteristic damage (defects, cracks, dislocations...) in the substrate material. Specia ...
Platinum/tantalum/silicon ohmic contacts were designed, fabricated and characterized to withstand high-temperature post-processing: the ohmic behavior was maintained after 1 h annealing, at temperatures up to 850 degrees C in an oxidizing environment. A LP ...
Hermiticity is an essential requirement of a MEMS package for a device to work properly. Hermeticity also must be preserved during the operations following packaging, during which the package bond should not remelt. Bonding temperature is limited however t ...
In the framework of the NanoTera project CabTuRes, a system-in-package for a nano-resonator was proposed, integrating CMOS driving electronics and vacuum encapsulation. This doctoral research aimed to investigate 3D-integration technologies for a Single-Wa ...
High pressure-rated channels allow microfluidic assays to be performed on a smaller footprint while keeping the throughput, thanks to the higher enabled flow rates, opening perspectives for cost-effective integration of CMOS chips to microfluidics circuits ...
We present a low-temperature indium hermetic bonding technique on wafer level without using flux, active atmosphere or other pretreatment of the indium. Its simplicity and low temperatures allow encapsulation of sensitive MEMS devices. Bonding stronger tha ...
This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...
We present a novel technique for heterogeneous integration using gold filled Through Silicon Vias (TSV) and thermocompression bond bumps formed in a single fabrication step, using gold nanoparticles dispensed by inkjet printing. Gold-filled TSV arrays (12 ...
Three Dimensional (3D) integration, based on through silicon vias (TSV), has the potential to become a key enabling technology for many applications. TSVs are commonly categorized according to their aspect ratio and diameter. An equally important parameter ...