Solutions for thermally mismatched brazing operations for ceramic tokamak magnetic sensor
Graph Chatbot
Chat with Graph Search
Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.
DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.
A systematic study of the solidification mechanisms of binary Sn-Cu and ternary Sn-Cu-Ni alloys has been carried out. It is found that Sn-Cu is a weakly-irregular eutectic system with Cu6Sn5 as the leading phase. Interestingly, two different eutectic morph ...
This paper presents a preliminary work on the feeding of an AC dipole using a resonant circuit with a varying resonant frequency. A single phase LC oscillator containing a variable capacitor is fed by a wide band amplifier or a voltage source inverter. For ...
Institute of Electrical and Electronics Engineers2011
Capillary fluidic self-assembly (SA) intrinsically features massively-parallel, contactless die handling and allows for high-precision die placement. It may thus boost die-to-substrate assembly throughput and scalability. Here we characterize for the first ...
The dielectric, electrical and structural properties of (1-x) (0.94Bi(1/2)Na(1/2)TiO(3)-0.06BaTiO(3))-xK(0.5)Na(0.5)NbO(3) (BNT-BT-xKNN) with x=0.09, 0.12, 0.15, and 0.18 were investigated as potential candidates for high-temperature capacitors with a work ...
In practice, some differences are usually observed between computer simulation and experimental results of a chaotic circuit. In this paper, it is tried to obtain computer simulation results having more correlation with those obtained in practice by using ...
We report on the fabrication of a low cost sensing platform which includes printed / electroplated resistive thermometers and capacitive-based humidity sensors working at ultra low power consumption. Both types of devices were integrated on the same polyme ...
Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...
Residual stress relief in ceramic-metal joints produced by active brazing depends primarily on the plastic response of the filler metal. A procedure for the production and mechanical characterization of bulk active filler alloy specimens is developed. In p ...
Cutting-edge CMOS neurochips, which consist of a Microelectrode Array (MEA) manufactured on top of CMOS circuitry, allow the recording of the electrical activity of neural networks in-vitro, and their stimulation. As CMOS technology continues to scale down ...
Based on analogy between the charging and discharging of humans' tolerance to overheating stimuli and that of charge in an electrical capacitor, this paper proposes a simple mathematical model for predicting overheating risk given a set of measured / simul ...
