In this work, we analyze the effect of CF4/O-2 plasma treatment on the contact interface between the amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) semiconductor and Titanium-Gold electrodes. First, the influence of CF4/O-2 plasma treatment is evaluated using transmission line structures and compared to pure O-2 and CF4 plasma, resulting in a reduction of the contact resistance RC by a factor of 24.2 compared to untreated interfaces. Subsequently, the CF4/O-2 plasma treatment is integrated in the a-IGZO thin-film transistor (TFT) fabrication process flow. We achieve a reduction of the gate bias dependent RC by a factor up to 13.4, which results in an increased current drive capability. Combined with an associated channel length reduction, the effective linear field-effect mobility mu(lin,FE,eff) is increased by up to 74.6% for the CF4/O-2 plasma treated TFTs compared to untreated reference devices.
Elison de Nazareth Matioli, Luca Nela, Taifang Wang
Mihai Adrian Ionescu, Igor Stolichnov, Ali Saeidi, Teodor Rosca, Sadegh Kamaei Bahmaei, Eamon Patrick O'Connor, Matteo Cavalieri, Carlotta Gastaldi
Jean-Michel Sallese, Adil Koukab, Gennaro Termo, Stefano Michelis