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An ultrafine grained (UFG) bulk Cu with a novel nacre-inspired lamellar structure containing nano-bridges and aligned nanopores at inter-lamellar interfaces was fabricated by consolidation of a nanocrystal-attached ultrathin Cu flake powder by spark plasma sintering with a relatively lower pressure (50 MPa) followed by hot rolling. It was discovered that the bulk UFG Cu with such a novel structure has both higher strength and higher toughness (static toughness) than its counterpart with a conventional UFG structure, despite the latter has a perceived better metallurgical quality as evidenced by a lower content of pores. The formation mechanism of the nacre-inspired microstructure in bulk Cu and its correlation with strengthening and toughening mechanisms were illustrated. (C) 2020 Elsevier B.V. All rights reserved.
Yves Weinand, Aryan Rezaei Rad, Henry V. Burton
Scott Walbridge, Matthew James Sjaarda