Simulation of silicon KOH and dry etching methods for micromould fabrication
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Institute of Electrical and Electronics Engineers1998
We present powder blasting as a new technology for the realization of Micro Electro-Mechanical Systems (MEMS). The technique is base don the erosion of a masked substrate by a high velocity powder beam. We study the erosion rate of the process using glass ...
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The flexibility of the new available Inductively Coupled Plasma (ICP) reactors provides a lot of possibilities for process development in dry etching field. Deep anisotropic etching of silicon is now possible under control (etch rate, profiles, uniformity) ...
