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Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...
EPFL2016
Nanocrystalline (NC) metals have attracted widespread interest in materials science due to their high strength compared to coarse-grained counterparts. It is well know that during uniaxial deformation, the stress-strain behaviour exhibits an extraordinary ...
EPFL2016
In this work, molecular statics and molecular dynamics simulations of a/2 < 110 > dislocation behavior for a model FCC Co30Fe16.67Ni36.67Ti16.67 alloy are discussed. It is shown that the single FCC phase is elastically stable in this alloy. Local stacking ...
Elsevier2017
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Dislocation dynamics are important to understand material plasticity effects, e.g. size dependent strain hardening. Dislocations are nucleated at nano-scale, and interact with other defects including grain boundaries and other dislocations at micro-scale. ...
2016
The macroscopic strength of metals is determined by the dislocation arrangements that are formed when dislocations slip in the crystal lattice in response to the applied stress. Despite the extensive research carried out, the transition from uniform to non ...
Dislocation core structures of hcp metals are highly complex and differ significantly among the hcp family. Some dislocations undergo unconventional transformations that have significant effects on the material plastic flow. Here, the energetics of disloca ...
Magnesium has multiple dislocation and twinning systems with starkly different properties, which make its plastic deformation strongly anisotropic and highly complex. Existing empirical interatomic potentials fail to capture the full scope of these propert ...
Molecular dynamics simulations were performed to study the deformation mechanisms of < 110 >-oriented, faceted Cu and Au nanowires under bending along three different crystallographic directions. Independent of the bending direction, the stress field is ch ...
Metal fatigue during cyclic loading puts an endurance limit on most of today's technology. It impacts the reliability of metallic components used for transportation, electronic devices and energy production because fatigue failure can occur without any app ...
Three newly identified cross-slip mechanisms from atomistic simulations of fcc crystals, namely surface, bulk and intersection cross-slip types, were hierarchically informed into discrete dislocation dynamics simulations. The influence of each cross-slip t ...
