EngineeringEngineering is the practice of using natural science, mathematics, and the engineering design process to solve problems, increase efficiency and productivity, and improve systems. Modern engineering comprises many subfields which include designing and creating infrastructure, machinery, vehicles, electronics, materials, and energy. The discipline of engineering encompasses a broad range of more specialized fields of engineering, each with a more specific emphasis on particular areas of applied mathematics, applied science, and types of application.
CPU socketIn computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering. Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred.
Chemical engineeringChemical engineering is an engineering field which deals with the study of operation and design of chemical plants as well as methods of improving production. Chemical engineers develop economical commercial processes to convert raw materials into useful products. Chemical engineering uses principles of chemistry, physics, mathematics, biology, and economics to efficiently use, produce, design, transport and transform energy and materials.
Reynolds numberIn fluid mechanics, the Reynolds number (Re) is a dimensionless quantity that helps predict fluid flow patterns in different situations by measuring the ratio between inertial and viscous forces. At low Reynolds numbers, flows tend to be dominated by laminar (sheet-like) flow, while at high Reynolds numbers, flows tend to be turbulent. The turbulence results from differences in the fluid's speed and direction, which may sometimes intersect or even move counter to the overall direction of the flow (eddy currents).
Large eddy simulationLarge eddy simulation (LES) is a mathematical model for turbulence used in computational fluid dynamics. It was initially proposed in 1963 by Joseph Smagorinsky to simulate atmospheric air currents, and first explored by Deardorff (1970). LES is currently applied in a wide variety of engineering applications, including combustion, acoustics, and simulations of the atmospheric boundary layer. The simulation of turbulent flows by numerically solving the Navier–Stokes equations requires resolving a very wide range of time and length scales, all of which affect the flow field.
Reduced instruction set computerIn computer engineering, a reduced instruction set computer (RISC) is a computer architecture designed to simplify the individual instructions given to the computer to accomplish tasks. Compared to the instructions given to a complex instruction set computer (CISC), a RISC computer might require more instructions (more code) in order to accomplish a task because the individual instructions are written in simpler code.
Thermal design powerThe thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called scenario design power (SDP) for some Ivy Bridge Y-series processors.
Processor designProcessor design is a subfield of computer science and computer engineering (fabrication) that deals with creating a processor, a key component of computer hardware. The design process involves choosing an instruction set and a certain execution paradigm (e.g. VLIW or RISC) and results in a microarchitecture, which might be described in e.g. VHDL or Verilog. For microprocessor design, this description is then manufactured employing some of the various semiconductor device fabrication processes, resulting in a die which is bonded onto a chip carrier.
ConvectionConvection is single or multiphase fluid flow that occurs spontaneously due to the combined effects of material property heterogeneity and body forces on a fluid, most commonly density and gravity (see buoyancy). When the cause of the convection is unspecified, convection due to the effects of thermal expansion and buoyancy can be assumed. Convection may also take place in soft solids or mixtures where particles can flow. Convective flow may be transient (such as when a multiphase mixture of oil and water separates) or steady state (see Convection cell).
Particulate pollutionParticulate pollution is pollution of an environment that consists of particles suspended in some medium. There are three primary forms: atmospheric particulate matter, marine debris, and space debris. Some particles are released directly from a specific source, while others form in chemical reactions in the atmosphere. Particulate pollution can be derived from either natural sources or anthropogenic processes. Atmospheric particulate matter, also known as particulate matter, or PM, describes solids and/or liquid particles suspended in a gas, most commonly the Earth's atmosphere.
