LHCb experimentThe LHCb (Large Hadron Collider beauty) experiment is a particle physics detector experiment collecting data at the Large Hadron Collider at CERN. LHCb is a specialized b-physics experiment, designed primarily to measure the parameters of CP violation in the interactions of b-hadrons (heavy particles containing a bottom quark). Such studies can help to explain the matter-antimatter asymmetry of the Universe. The detector is also able to perform measurements of production cross sections, exotic hadron spectroscopy, charm physics and electroweak physics in the forward region.
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
High-energy nuclear physicsHigh-energy nuclear physics studies the behavior of nuclear matter in energy regimes typical of high-energy physics. The primary focus of this field is the study of heavy-ion collisions, as compared to lighter atoms in other particle accelerators. At sufficient collision energies, these types of collisions are theorized to produce the quark–gluon plasma. In peripheral nuclear collisions at high energies one expects to obtain information on the electromagnetic production of leptons and mesons that are not accessible in electron–positron colliders due to their much smaller luminosities.
Electronic design automationElectronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), is a category of software tools for designing electronic systems such as integrated circuits and printed circuit boards. The tools work together in a design flow that chip designers use to design and analyze entire semiconductor chips. Since a modern semiconductor chip can have billions of components, EDA tools are essential for their design; this article in particular describes EDA specifically with respect to integrated circuits (ICs).
Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
Apollo Lunar ModuleThe Apollo Lunar Module (LM ˈlɛm), originally designated the Lunar Excursion Module (LEM), was the lunar lander spacecraft that was flown between lunar orbit and the Moon's surface during the United States' Apollo program. It was the first crewed spacecraft to operate exclusively in the airless vacuum of space, and remains the only crewed vehicle to land anywhere beyond Earth. Structurally and aerodynamically incapable of flight through Earth's atmosphere, the two-stage lunar module was ferried to lunar orbit attached to the Apollo command and service module (CSM), about twice its mass.
Pentium IIThe Pentium II brand refers to Intel's sixth-generation microarchitecture ("P6") and x86-compatible microprocessors introduced on May 7, 1997. Containing 7.5 million transistors (27.4 million in the case of the mobile Dixon with 256 KB L2 cache), the Pentium II featured an improved version of the first P6-generation core of the Pentium Pro, which contained 5.5 million transistors. However, its L2 cache subsystem was a downgrade when compared to the Pentium Pros. It is a single-core microprocessor.
Chip carrierIn electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large. Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is "flat pack".
DØ experimentThe DØ experiment (sometimes written D0 experiment, or DZero experiment) was a worldwide collaboration of scientists conducting research on the fundamental nature of matter. DØ was one of two major experiments (the other was the CDF experiment) located at the Tevatron Collider at Fermilab in Batavia, Illinois. The Tevatron was the world's highest-energy accelerator from 1983 until 2009, when its energy was surpassed by the Large Hadron Collider. The DØ experiment stopped taking data in 2011, when the Tevatron shut down, but data analysis is still ongoing.
SensorA sensor is a device that produces an output signal for the purpose of sensing a physical phenomenon. In the broadest definition, a sensor is a device, module, machine, or subsystem that detects events or changes in its environment and sends the information to other electronics, frequently a computer processor. Sensors are used in everyday objects such as touch-sensitive elevator buttons (tactile sensor) and lamps which dim or brighten by touching the base, and in innumerable applications of which most people are never aware.
