Semiconductor packageA semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure.
MEMSMEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.
Packet switchingIn telecommunications, packet switching is a method of grouping data into packets that are transmitted over a digital network. Packets are made of a header and a payload. Data in the header is used by networking hardware to direct the packet to its destination, where the payload is extracted and used by an operating system, application software, or higher layer protocols. Packet switching is the primary basis for data communications in computer networks worldwide.
Optical tweezersOptical tweezers (originally called single-beam gradient force trap) are scientific instruments that use a highly focused laser beam to hold and move microscopic and sub-microscopic objects like atoms, nanoparticles and droplets, in a manner similar to tweezers. If the object is held in air or vacuum without additional support, it can be called optical levitation. The laser light provides an attractive or repulsive force (typically on the order of piconewtons), depending on the relative refractive index between particle and surrounding medium.
Fabless manufacturingFabless manufacturing is the design and sale of hardware devices and semiconductor chips while outsourcing their fabrication (or fab) to a specialized manufacturer called a semiconductor foundry. These foundries are typically, but not exclusively, located in the United States, China, and Taiwan. Fabless companies can benefit from lower capital costs while concentrating their research and development resources on the end market. Some fabless companies and pure play foundries (like TSMC) may offer integrated-circuit design services to third parties.
Wafer-level packagingWafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Quad flat packageA quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP). The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies.
Optical communicationOptical communication, also known as optical telecommunication, is communication at a distance using light to carry information. It can be performed visually or by using electronic devices. The earliest basic forms of optical communication date back several millennia, while the earliest electrical device created to do so was the photophone, invented in 1880. An optical communication system uses a transmitter, which encodes a message into an optical signal, a channel, which carries the signal to its destination, and a receiver, which reproduces the message from the received optical signal.
Waveguide filterA waveguide filter is an electronic filter constructed with waveguide technology. Waveguides are hollow metal conduits inside which an electromagnetic wave may be transmitted. Filters are devices used to allow signals at some frequencies to pass (the passband), while others are rejected (the stopband). Filters are a basic component of electronic engineering designs and have numerous applications. These include selection of signals and limitation of noise.
Multilayer switchA multilayer switch (MLS) is a computer networking device that switches on OSI layer 2 like an ordinary network switch and provides extra functions on higher OSI layers. The MLS was invented by engineers at Digital Equipment Corporation. Switching technologies are crucial to network design, as they allow traffic to be sent only where it is needed in most cases, using fast, hardware-based methods. Switching uses different kinds of network switches. A standard switch is known as a layer 2 switch and is commonly found in nearly any LAN.
