Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
Data link layerThe data link layer, or layer 2, is the second layer of the seven-layer OSI model of computer networking. This layer is the protocol layer that transfers data between nodes on a network segment across the physical layer. The data link layer provides the functional and procedural means to transfer data between network entities and may also provide the means to detect and possibly correct errors that can occur in the physical layer. The data link layer is concerned with local delivery of frames between nodes on the same level of the network.
Network layerIn the seven-layer OSI model of computer networking, the network layer is layer 3. The network layer is responsible for packet forwarding including routing through intermediate routers. The network layer provides the means of transferring variable-length network packets from a source to a destination host via one or more networks. Within the service layering semantics of the OSI (Open Systems Interconnection) network architecture, the network layer responds to service requests from the transport layer and issues service requests to the data link layer.
Collision cascadeIn condensed-matter physics, a collision cascade (also known as a displacement cascade or a displacement spike) is a set of nearby adjacent energetic (much higher than ordinary thermal energies) collisions of atoms induced by an energetic particle in a solid or liquid. If the maximum atom or ion energies in a collision cascade are higher than the threshold displacement energy of the material (tens of eVs or more), the collisions can permanently displace atoms from their lattice sites and produce defects.
PaperPaper is a thin sheet material produced by mechanically or chemically processing cellulose fibres derived from wood, rags, grasses, or other vegetable sources in water, draining the water through a fine mesh leaving the fibre evenly distributed on the surface, followed by pressing and drying. Although paper was originally made in single sheets by hand, almost all is now made on large machines—some making reels 10 metres wide, running at 2,000 metres per minute and up to 600,000 tonnes a year.
Thermoset polymer matrixA thermoset polymer matrix is a synthetic polymer reinforcement where polymers act as binder or matrix to secure in place incorporated particulates, fibres or other reinforcements. They were first developed for structural applications, such as glass-reinforced plastic radar domes on aircraft and graphite-epoxy payload bay doors on the Space Shuttle. They were first used after World War II, and continuing research has led to an increased range of thermoset resins, polymers or plastics, as well as engineering grade thermoplastics.
Coated paperCoated paper (also known as enamel paper, gloss paper, and thin paper) is paper that has been coated by a mixture of materials or a polymer to impart certain qualities to the paper, including weight, surface gloss, smoothness, or reduced ink absorbency. Various materials, including kaolinite, calcium carbonate, bentonite, and talc, can be used to coat paper for high-quality printing used in the packaging industry and in magazines. The chalk or china clay is bound to the paper with synthetic s, such as styrene-butadiene latexes and natural organic binders such as starch.
Presentation layerIn the seven-layer OSI model of computer networking, the presentation layer is layer 6 and serves as the data translator for the network. It is sometimes called the syntax layer. Within the service layering semantics of the OSI network architecture, the presentation layer responds to service requests from the application layer and issues service requests to the session layer through a unique presentation service access point (PSAP).
Binary collision approximationIn condensed-matter physics, the binary collision approximation (BCA) is a heuristic used to more efficiently simulate the penetration depth and defect production by energetic ions (with kinetic energies in the kilo-electronvolt (keV) range or higher) in solids. In the method, the ion is approximated to travel through a material by experiencing a sequence of independent binary collisions with sample atoms (nuclei). Between the collisions, the ion is assumed to travel in a straight path, experiencing electronic stopping power, but losing no energy in collisions with nuclei.
SputteringIn physics, sputtering is a phenomenon in which microscopic particles of a solid material are ejected from its surface, after the material is itself bombarded by energetic particles of a plasma or gas. It occurs naturally in outer space, and can be an unwelcome source of wear in precision components. However, the fact that it can be made to act on extremely fine layers of material is utilised in science and industry—there, it is used to perform precise etching, carry out analytical techniques, and deposit thin film layers in the manufacture of optical coatings, semiconductor devices and nanotechnology products.
