Logic family

Résumé

In computer engineering, a logic family is one of two related concepts:

A logic family of monolithic digital integrated circuit devices is a group of electronic logic gates constructed using one of several different designs, usually with compatible logic levels and power supply characteristics within a family. Many logic families were produced as individual components, each containing one or a few related basic logical functions, which could be used as "building-blocks" to create systems or as so-called "glue" to interconnect more complex integrated circuits.
A logic family may also be a set of techniques used to implement logic within VLSI integrated circuits such as central processors, memories, or other complex functions. Some such logic families use static techniques to minimize design complexity. Other such logic families, such as domino logic, use clocked dynamic techniques to minimize size, power consumption and delay.

Before the widespread use of integrated circuits, var

Source officielle

https://en.wikipedia.org/wiki/Logic_family

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New Logic Family Based on Hybrid MOSFET-Polysilicon Nano-Wires

Didier Bouvet, Michel Declercq, Serge Ecoffey, Mihai Adrian Ionescu, Yusuf Leblebici, Marco Mazza, Vincent Pott, Alexandre Schmid

2005

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Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling

David Atienza Alonso, Pablo Garcia del Valle

State-of-the-art devices in the consumer electronics market are relying more and more on Multi-Processor Systems-On-Chip (MPSoCs) as an efficient solution to meet their multiple design constrains, such as low cost, low power consumption, high performance and short time-to-market. In fact, as technology scales down, logic density and power density increase, generating hot spots that seriously affect the MPSoC performance and can physically damage the final system behavior. Moreover, forthcoming three-dimensional (3D) MPSoCs can achieve higher system integration density, but the aforementioned thermal problems are seriously aggravated. Thus, new thermal exploration tools are needed to study the temperature variation effects inside 3D MPSoCs. In this paper, we present a novel approach for fast transient thermal modeling and analysis of 3D MPSoCs with active (liquid) cooling solutions, while capturing the hardware-software interaction. In order to preserve both accuracy and speed, we propose a close-loop framework that combines the use of Field Programmable Gate Arrays (FPGAs) to emulate the hardware components of 2D/3D MPSoC platforms with a highly optimized thermal simulator, which uses an RC-based linear thermal model to analyze the liquid flow. The proposed framework offers speed-ups of more than three orders of magnitude when compared to cycle-accurate 3D MPSoC thermal simulators. Thus, this approach enables MPSoC designers to validate different hardware- and software-based 3D thermal management policies in real-time, and while running real-life applications, including liquid cooling injection control

Elsevier2010

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Digital circuit techniques for mixed analog/digital circuits applications

Michel Declercq, Maher Kayal

This paper presents a detailed analysis of CSL (Current Steering Logic) [1] and compares its characteristics with FSCL (Folded Source Coupled Logic) [1,2,3], two logic families intended to be applied in mixed-mode CMOS circuits. These logic families generate small current spikes compared to the CMOS static family. They feature high robustness to process fluctuations, and are capable to operate at low quiescent current and power supply voltage. Simulation results, based on ES2 0.7 CMOS low voltage technology, are presented.

1996

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