Concept

Circuit intégré à signaux mixtes

Publications associées (586)

Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuit ...

EPFL2015

A Fast Pruning Technique for Low-Power Inexact Circuit Design

Giovanni De Micheli, Pierre-Emmanuel Julien Marc Gaillardon, Luca Gaetano Amarù, Jaime Joven Murillo, Johan Broc

Inexact Circuits are circuits in which the accuracy of the output can be traded for cost savings (energy, area and/or delay). In the context of advanced technology scaling and power density increase, inexact circuits appear to be very promising as ...

IEEE2015

Implantable Multi-panel Platform for Continuous Monitoring of Exogenous and Endogenous Metabolites for Applications in Personalized Medicine

Camilla Baj-Rossi

Nowadays, scientific advances are leading to the discovery of newer, better, more targeted treatments that will improve the human health. However, despite the promising results and the major advantages in treatments offered to patients, these personalized ...

EPFL2015

Compressive image acquisition in modern CMOS IC design

Pierre Vandergheynst, Alexandre Schmid, Yusuf Leblebici, Mahdad Hosseini Kamal, Nikola Katic

Compressive sampling (CS) offers bandwidth, power, and memory size reduction compared to conventional (Nyquist) sampling. These are very attractive features for the design of modern complementary metal-oxide semiconductor (CMOS) image sensors, cameras, and ...

Wiley-Blackwell2015

A Study on Buffer Distribution for RRAM-based FPGA Routing Structures

Giovanni De Micheli, Pierre-Emmanuel Julien Marc Gaillardon, Xifan Tang, Somayyeh Rahimian Omam

Compared to Application-Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) provide reconfigurablity at the cost of lower performance and higher power consumption. Exploiting a large number of programmable switche ...

IEEE2015

Electro-thermal virtual prototyping of a Rogowski Coil sensor system

Alain Vachoux, Juan Sebastian Rodriguez Estupinan

An electro-thermal model of a Rogowski Coil sensor system is here described. A co-design methodology between VHDL-AMS and Finite Element Analysis (FEA) has been used for modeling the entire system. The proposed modeling strategy uses geometrical FEA to com ...

IEEE2015

A mixed-signal computer architecture and its application to power system problems

Theodoros Kyriakidis

Radical changes are taking place in the landscape of modern power systems. This massive shift in the way the system is designed and operated has been termed the advent of the ``smart grid''. One of its implications is a strong market pull for faster power ...

EPFL2015

A Relative Imaging CMOS Image Sensor for High Dynamic Range and High Frame-Rate Machine Vision Imaging Applications

Alexandre Schmid, Yusuf Leblebici, Vladan Popovic, Nikola Katic, Radisav Cojbasic

This paper proposes an unconventional image acquisition scheme for machine vision applications, based on detecting ratios of illumination (pixel) intensities. Detecting relative ratios enables capturing the scene features and patterns almost independently ...

Institute of Electrical and Electronics Engineers2015

Heterogeneous Integration of ReRAM Crossbars in 180nm CMOS BEoL Process

Giovanni De Micheli, Davide Sacchetto, Yusuf Leblebici, Pierre-Emmanuel Julien Marc Gaillardon, Jury Sandrini, Tugba Demirci, Maxime Victor Thammasack

This work reports on a heterogeneous integration of resistive memories into the Back-End-of-the-Line of 180nm standard CMOS foundry chips. A TaOx-based ReRAM technology with materials and processes fully CMOS compatible has been developed and characterized ...

Elsevier2015

Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

Giovanni De Micheli, Luca Benini

3-D integrated circuits (3-D ICs) offer a promising solution to overcome the scaling limitations of 2-D ICs. However, using too many through-silicon-vias (TSVs) pose a negative impact on 3-D ICs due to the large overhead of TSV (e.g., large footprint and l ...

Institute of Electrical and Electronics Engineers2015

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