Concept

Boîtier de circuit intégré

Publications associées (87)

Controlling On-Surface Photoactivity: The Impact of π-Conjugation in Anhydride-Functionalized Molecules on a Semiconductor Surface

On-surface synthesis has become a prominent method for growing low-dimensional carbon-based nanomaterials on metal surfaces. However, the necessity of decoupling organic nanostructures from metal substrates to exploit their properties requires either trans ...

Wiley-V C H Verlag Gmbh2024

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Rafael Medina Morillas, Joshua Alexander Harrison Klein

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

Energy-Efficient Electronic Functions Based on the Co-integration of 2D and Ferroelectric Materials

Sadegh Kamaei Bahmaei

The digital revolution has significantly transformed our world over the past decades, driven by the scaling of transistor dimensions and the exponential increase in computation power. However, as the CMOS scaling era approaches its end, the semiconductor i ...

EPFL2023

Nonlinear Frequency Conversion in III-Nitride Doubly Resonant Photonic Crystal Cavities

Jun Wang

Nonlinear frequency conversion processes, such as second-harmonic generation (SHG) and spontaneous parametric down-conversion (SPDC), are essential in many applications, including the generation of entangled photons. It's desirable to enhance these process ...

EPFL2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Göran Stemme

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Development of an encapsulation solution for suspended microchannel resonators

The goal of this project is to create a reliable process flow for the fabrication of a vacuum encapsulation for a resonator. This process shall be done in few steps and with standard processes from cleanroom. This encapsulation provides a wafer-level packa ...

2021

Chip-based soliton microcomb module using a hybrid semiconductor laser

Tobias Kippenberg, Rui Ning Wang, Nicolas Volet, Junqiu Liu, Erwan Guillaume Albert Lucas, Arslan Sajid Raja, Jijun He

Photonic chip-based soliton microcombs have shown rapid progress and have already been used in many system-level applications. There has been substantial progress in realizing soliton microcombs that rely on compact laser sources, culminating in devices th ...

OPTICAL SOC AMER2020

Integration of hybrid material systems in conformable neural interfaces

Florian Dylan Fallegger

Neural interfaces are devices that are implanted into the body and interface electrically with the central (CNS) or peripheral nervous system. They are inserted surgically for short periods of time or chronically to diagnose or treat several neural disease ...

EPFL2020

Multispectral image sensor and method for fabrication of an image sensor

Assim Boukhayma

The present invention relates to a multispectral image sensor having a pixel array for detecting images with light components in different wavelength ranges, comprising a plurality of imaging layers each embedded in a semiconductor substrate, wherein in ea ...

2020

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