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A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology

Edoardo Charbon, Myung Jae Lee, Preethi Padmanabhan, Augusto Ronchini Ximenes

This article introduces a modular, direct time-of-flight (TOF) depth sensor. Each module is digitally synthesized and features a 2

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8) single-photon avalanche diode (SPAD) pixel array, an edge-sensitive decision tree, a shared time-to ...

2019

Scanner (informatique)

Graph Chatbot

Chattez avec Graph Search

Learning to Find Unpaired Cross-Spectral Correspondences

Enhanced MR Image Classification Using Hybrid Statistical and Wavelets Features

Oscillator arrangement for time-to-digital converter for large array of time-of-flight image sensor devices

A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology

FTIR Calibration

5.2 Energy-Efficient Low-Noise CMOS Image Sensor with Capacitor Array-Assisted Charge-Injection SAR ADC for Motion-Triggered Low-Power IoT Applications

Optimizing the signal-to-noise ratio for direct-detection BOTDA

A Physical Model of Nonstationary Blur in Ultrasound Imaging

Electron Spin Resonance detectors from 400 MHz to 360 GHz

On Advanced Large-Field Photolithography

Learning to Find Unpaired Cross-Spectral Correspondences

FTIR Calibration

Oscillator arrangement for time-to-digital converter for large array of time-of-flight image sensor devices

5.2 Energy-Efficient Low-Noise CMOS Image Sensor with Capacitor Array-Assisted Charge-Injection SAR ADC for Motion-Triggered Low-Power IoT Applications

Optimizing the signal-to-noise ratio for direct-detection BOTDA

Enhanced MR Image Classification Using Hybrid Statistical and Wavelets Features

On Advanced Large-Field Photolithography

A Physical Model of Nonstationary Blur in Ultrasound Imaging

Electron Spin Resonance detectors from 400 MHz to 360 GHz

A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology