Concept

Dual Inline Package

Publications associées (48)

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Rafael Medina Morillas, Joshua Alexander Harrison Klein

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

Subharmonic parametric instability in nearly brimful circular cylinders: a weakly nonlinear analysis

François Gallaire, Alessandro Bongarzone, Francesco Viola

In labscale Faraday experiments, meniscus waves respond harmonically to small-amplitude forcing without threshold, hence potentially cloaking the instability onset of parametric waves. Their suppression can be achieved by imposing a contact line pinned at ...

CAMBRIDGE UNIV PRESS2022

Integration of hybrid material systems in conformable neural interfaces

Florian Dylan Fallegger

Neural interfaces are devices that are implanted into the body and interface electrically with the central (CNS) or peripheral nervous system. They are inserted surgically for short periods of time or chronically to diagnose or treat several neural disease ...

EPFL2020

Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits

Elison de Nazareth Matioli, Remco Franciscus Peter van Erp, Luca Nela, Georgios Kampitsis, Reza Soleiman Zadeh Ardebili

In this work, we demonstrate a new thermal management approach for direct cooling of GaN-on-Si power integrated circuits (ICs), in which the Si substrate functions as a microfluidic heat sink, turning Si into a cost-effective, high thermal performance subs ...

IEEE2020

Optimized Module Packaging for Silicon Heterojunction Solar Cells and Increased PID Resistance

Recent studies showed that silicon heterojunction (SHJ) solar cells can be prone to potential induced degradation (PID) when encapsulated with a low volume resistivity ethylene vinyl acetate (EVA). We perform PID test in humid conditions (85°C/85% RH) on g ...

EU PVSEC Proceedings2020

Two-Element Antenna-Active Phase Shifter Packaging at 77 GHz

Anja Skrivervik, Efe Öztürk

This work presents a low cost and wire-bonded active phase shifter chip to RF circuitry on PCB board packaging for implementing a two-element phased array antenna at 77 GHz. The 1.5 mm × 1.1 mm chip is embedded in RO3003 PCB board and its GSG ports are wir ...

IEEE2019

Pediatric Size Swallowable Glass Pill for Digestive Motility Analysis

Catherine Dehollain, Vincent Schlageter, Onur Kazanç

A glass pill for digestive motility tracking with wireless communication is presented. The pill encapsulates three magnetic transmitter coils with a 125 kHz signal, the circuitry required to control the magnetic coil output and the battery. The system prov ...

IEEE2018

Learning-Based Hardware Design for Data Acquisition Systems

Cosimo Aprile

This multidisciplinary research work aims to investigate the optimized information extraction from signals or data volumes and to develop tailored hardware implementations that trade-off the complexity of data acquisition with that of data processing, conc ...

EPFL2018

10.1 A pin-efficient 20.83Gb/s/wire 0.94pJ/bit forwarded clock CNRZ-5-coded SerDes up to 12mm for MCM packages in 28nm CMOS

Mohammad Amin Shokrollahi, Seyed Armin Tajalli, Christoph Walter, Ali Hormati, Anant Pratap Singh, Omid Talebi Amiri, Klaas Lammert Hofstra, Sergio Pesenti

High-speed signaling over package substrates is key to delivering the promise of 2.5D integration. Applications abound and include high-density memory interfaces, sub-division of large dies to increase yield and lower development time, sub-division of a di ...

2016

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