Encapsulation (électronique)

En électronique, l'encapsulation consiste à protéger, mettre dans un boîtier, un composant ou un circuit, afin de le protéger des agressions de l'environnement extérieur, tout en assurant les connexions électriques nécessaires à son fonctionnement (connectique). On utilise aussi le terme packaging, dérivé de l'anglais. Article connexe

Décapsulation (électronique)

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L’International Microelectronics and Packaging Society

Catégorie:Fabrication de circuits électroniques

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Micromechanical resonators with sub-micron gaps filled with high-k dielectrics

Mariazel de la Candelas Maqueda López

Scaled microelectromechanical (MEMS) resonating devices have generated a great interest for their use in RF front-end architectures for wireless communication, channel-select filters, on-chip signal processing and timing and extreme mas sensing applications thanks to their robustness, low power consumption, easy integration with CMOS and multimode reconfigurability. Therefore, MEMS resonators are a promising alternative to various discrete electrical components, offering excellent figures of merit at in the HF/VHF frequency range. However, there are many remaining open challenges for the research on MEMS resonators such as high quality factor at high frequency, thermal stability, reduced motional resistance, frequency precision and stability, low phase noise and appropriate hermetical and low cost packaging. Many advanced MEMS resonators use deep sub-micron air gaps (

EPFL2017

Chargement

Reliability of rf mems capacitive switches and distributed mems phase shifters using aln dielectric

Montserrat Fernandez-Bolanos Badia, Mihai Adrian Ionescu, Dimitrios Tsamados

The reliability and charging/discharging dynamics of wideband (1.5-14GHz) phase shifters made of MEMS capacitive switches using Aluminum Nitride (AlN) as dielectric are originally reported. Phase shifter lifetimes exceeding 109 cycles are achieved in hot-cycling (+5dBm RF power). Dynamic tests were done for the first time under ambient conditions (5000 humidity) over 2x109 cycles with no major degradation of individual switches performances. It is demonstrated that the phase shifter is very robust (no permanent failure or stiction) and can withstand environmental effects as well as high temperature variations, without the need of expensive hermetical packaging. The excellent reliability is attributed to the slow dielectric charging (a square-root time law) and fast discharging mechanism of AlN (an exponential time law proposed and validated in our work). We extend the validity of charging and discharging models from single device to arrays of parallel MEMS capacitors. ©2009 IEEE.

2009

Chargement

Self-Assembly from Milli- to Nanoscales: Methods and Applications

Massimo Mastrangeli

The design and fabrication techniques for microelectromechanical systems (MEMS) and nanodevices are progressing rapidly. However, due to material and process flow incompatibilities in the fabrication of sensors, actuators and electronic circuitry, a final packaging step is often necessary to integrate all components of a heterogeneous microsystem on a common substrate. Robotic pick-and-place, although accurate and reliable at larger scales, is a serial process that downscales unfavorably due to stiction problems, fragility and sheer number of components. Self-assembly, on the other hand, is parallel and can be used for device sizes ranging from millimeters to nanometers. In this review, the state-of-the-art in methods and applications for self-assembly is reviewed. Methods for assembling three-dimensional (3D) MEMS structures out of two-dimensional (2D) ones are described. The use of capillary forces for folding 2D plates into 3D structures, as well as assembling parts onto a common substrate or aggregating parts to each other into 2D or 3D structures, is discussed. Shape matching and guided assembly by magnetic forces and electric fields are also reviewed. Finally, colloidal self-assembly and DNA-based self-assembly, mainly used at the nanoscale, are surveyed, and aspects of theoretical modeling of stochastic assembly processes are discussed.

Institute of Physics2009

Chargement

Fabrication des dispositifs à semi-conducteurs

thumb|upright=1.5|Évolution de la finesse de gravure des processeurs entre 1970 et 2017 La fabrication des dispositifs à semi-conducteur englobe les différentes opérations permettant l'élaboration de

Circuit intégré

Le circuit intégré (CI), aussi appelé puce électronique, est un composant électronique, basé sur un semi-conducteur, reproduisant une ou plusieurs fonctions électroniques plus ou moins complexes, in

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A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically usin

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