Concept

Encapsulation (électronique)

Publications associées (212)

Interlocking Folded Plate - Integrated Mechanical Attachment for Structural Timber Panels

Yves Weinand, Christopher Werner Matthias Robeller, Andrea Stitic, Paul Mayencourt

Automatic joinery has become a common technique for the jointing of beams in timber framing and roofing. It has revived traditional, integrated joints such as mortise and tenon connections. Similarly, but only recently, the automatic fabri- cation of tradi ...

Springer Verlag2014

Interlocking Folded Plate – Integrated Mechanical Attachment for Structural Timber Panels

Christopher Werner Matthias Robeller

2014

Large Arrays Of Inkjet-Printed Mems Microbridges On Foil

Nico de Rooij, Danick Briand, Francisco Molina Lopez

This works describes the fabrication process of an array of printed MEMS microbridges on polymeric foil, performed in only four easy steps. Each functional material was deposited exclusively by inkjet-printing technique, compatible with large-area fabricat ...

IEEE2014

A Modeling Environment for the Simulation and Design of Charge Redistribution DACs Used in SAR ADCs

Andrea Bonetti

The optimal design of successive approximation register (SAR) analog-to-digital converters (ADCs) requires the accurate estimate of nonlinearity and parasitic capacitance effects in the feedback charge-redistribution digital-to-analog converters (DACs). Si ...

2014

Printed and encapsulated environmental sensors on biodegradable polylactic acid (PLA)

Nico de Rooij, Danick Briand, Francisco Molina Lopez, Andres Felipe Vasquez Quintero, Alexis Pierre Henri Marette, Nathalie Frolet

We are dedicating efforts on the realization of smart packaging systems integrating environmental sensing capabilities based on plastic and printed electronics technologies. Here, we present the development, fabrication and characterization of printed gas ...

2014

Low temperature dye-sensitized solar cells based on conformal thin zinc oxide overlayer on mesoporous insulating template by atomic layer deposition

Michael Graetzel, Mohammad Khaja Nazeeruddin, Aravind Kumar Chandiran, Mojtaba Abdi Jalebi

Low temperature processing of Dye-sensitized Solar Cells (DSCs) is essential to enable commercialization with low cost plastic substrates and diminish the overall manufacturing cost. We report a low temperature processing route for photoanodes where thin Z ...

Elsevier Science Bv2014

Packaging technologies for high temperature control electronics

Peter Ryser, Yusuf Leblebici, Thomas Maeder, Conor Joseph Slater, Radisav Cojbasic

Current low temperature electronics (175°C) for prolonge ...

IMAPS2013

An implantable biosensor array for personalized therapy applications

Andrea Cavallini

At present, most of the tests involved in personalized medicine are complex and must be conducted in specialized centers. The development of appropriate, fast and inexpensive diagnostic technologies can encourage medical personnel in performing preventive ...

EPFL2013

Miniature curved artificial compound eyes

Dario Floreano, Ramon Pericet Camara, Michal Karol Dobrzynski, Géraud L'Eplattenier

In most animal species, vision is mediated by compound eyes, which offer lower resolution than vertebrate single-lens eyes, but significantly larger fields of view with negligible distortion and spherical aberration, and high temporal resolution in a tiny ...

National Academy of Sciences2013

A CMOS-compatible silicon photonic platform for high-speed integrated opto-electronics

Yi Zhang, Christophe Marcel Georges Galland, Yang Liu, Qi Li, Ran Ding

We have developed a CMOS-compatible Silicon-on-Insulator photonic platform featuring active components such as p- i-n and photoconductive (MIM) Ge-on-Si detectors, p-i-n ring and Mach-Zehnder modulators, and traveling-wave modulators based on a p-n junctio ...

2013

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