Publications associées à Multi-project wafer service

Co-design of ReRAM Passive Crossbar Arrays Integrated in 180nm CMOS Technology

Giovanni De Micheli, Davide Sacchetto, Yusuf Leblebici, Pierre-Emmanuel Julien Marc Gaillardon, Michele De Marchi, Jury Sandrini, Tugba Demirci, Maxime Victor Thammasack, Marios Barlas

This work presents the co-integration of resistive random access memory crossbars within a 180nm Read-Write CMOS chip. TaOx-based ReRAMs have been fabricated and characterized with materials and process steps compatible with the CMOS Back-End-of ...

Institute of Electrical and Electronics Engineers2016

Ultra-Low Power Ion-Sensing Smart Platform for Noninvasive Healthcare Applications

Mihai Adrian Ionescu, Erick Antonio Garcia Cordero, Hoël Maxime Guérin, Francesco Bellando, Amira Muhech Medrano

The development of nanotechnologies, and the advent of micro/nano-sensors with novel functionalities integrated on flexible substrates, has opened the way to the development of wearable technology. Interest in wearable technology comes from the considerabl ...

2016

W-Band MMIC Amplifiers Based on AlInN/GaN HEMTs Grown on Silicon

Nicolas Grandjean, Jean-François Carlin, Marco Malinverni, Lorenzo Lugani

We demonstrate W-band monolithic microwave integrated circuit (MMIC) amplifiers based on AlInN/GaN high electron mobility transistors (HEMTs) grown on Silicon. Our MMIC process was fully characterized to 110 GHz and a design kit generated to enable circuit ...

Ieee-Inst Electrical Electronics Engineers Inc2016

Heterogeneous Integration of Low Power pH FinFET sensors with Passive Capillary Microfluidics and miniaturized Ag/AgCl quasi-Reference Electrode

Mihai Adrian Ionescu, Erick Antonio Garcia Cordero, Hoël Maxime Guérin, Francesco Bellando, Amira Muhech Medrano

This work presents one of the first low power pH sensing microfluidic chip based on the heterogeneous integration of: (i) high-k FinFET sensors with liquid gate, (ii) miniaturized Ag/AgCl quasi-Reference Electrode and (iii) passive microfluidic. The integr ...

Ieee2016

A 15 mu W 5.5 kS/s Resistive Sensor Readout Circuit with 7.6 ENOB

Catherine Dehollain

A low power SAR logic-based resistive sensor readout circuit is proposed. A high sensitivity thermistor is used for local temperature measurements. The need for a low-noise front-end voltage amplifier is avoided by employing time-domain operation. In each ...

Institute of Electrical and Electronics Engineers2014

Improved test setup for MEMS mechanical strength investigations and fabrication process qualification

Herbert Shea, Xavier Maeder, Tobias Bandi

ABSTRACT The mechanical stability of silicon MEMS dies is strongly influenced by the microfabrication processes, especially grinding, dicing and etching, which leave characteristic damage (defects, cracks, dislocations...) in the substrate material. Specia ...

2014

Energy/Reliability Trade-Offs in Low-Voltage ReRAM-Based Non-Volatile Flip-Flop Design

Giovanni De Micheli, Andreas Peter Burg, Davide Sacchetto, Yusuf Leblebici, Pierre-Emmanuel Julien Marc Gaillardon, Pascal Andreas Meinerzhagen

The total power budget of Ultra-Low Power (ULP) VLSI Systems-on-Chip (SoCs) is often dominated by the leakage power of embedded memories as well as status registers. On the one hand, supply voltage scaling down to the near-threshold (near-VT

Institute of Electrical and Electronics Engineers2014

Bloch surface waves, a 2D platform for planar optical integration

Hans Peter Herzig, Elsie Barakat, Libo Yu, Richa Dubey

A novel platform suitable for fundamental investigations of light propagation through micro-and nanostructures will be discussed. This platform is based on a dielectric multilayer that sustains Bloch surface waves (BSWs). BSWs are electromagnetic surface w ...

Ieee2014

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Multi-project wafer service

Co-design of ReRAM Passive Crossbar Arrays Integrated in 180nm CMOS Technology

Ultra-Low Power Ion-Sensing Smart Platform for Noninvasive Healthcare Applications

W-Band MMIC Amplifiers Based on AlInN/GaN HEMTs Grown on Silicon

Heterogeneous Integration of Low Power pH FinFET sensors with Passive Capillary Microfluidics and miniaturized Ag/AgCl quasi-Reference Electrode

Method to fabricate finfet sensors, in particular, finfet sensors for ionic, chemical and biological applications on si-bulk

Heterogeneous integration of ReRAM crossbars in a CMOS foundry chip

A 15 mu W 5.5 kS/s Resistive Sensor Readout Circuit with 7.6 ENOB

Improved test setup for MEMS mechanical strength investigations and fabrication process qualification

Energy/Reliability Trade-Offs in Low-Voltage ReRAM-Based Non-Volatile Flip-Flop Design

Bloch surface waves, a 2D platform for planar optical integration

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Chattez avec Graph Search

Co-design of ReRAM Passive Crossbar Arrays Integrated in 180nm CMOS Technology

Improved test setup for MEMS mechanical strength investigations and fabrication process qualification

Method to fabricate finfet sensors, in particular, finfet sensors for ionic, chemical and biological applications on si-bulk

A 15 mu W 5.5 kS/s Resistive Sensor Readout Circuit with 7.6 ENOB

Heterogeneous integration of ReRAM crossbars in a CMOS foundry chip

Bloch surface waves, a 2D platform for planar optical integration

Heterogeneous Integration of Low Power pH FinFET sensors with Passive Capillary Microfluidics and miniaturized Ag/AgCl quasi-Reference Electrode

Energy/Reliability Trade-Offs in Low-Voltage ReRAM-Based Non-Volatile Flip-Flop Design

Ultra-Low Power Ion-Sensing Smart Platform for Noninvasive Healthcare Applications

W-Band MMIC Amplifiers Based on AlInN/GaN HEMTs Grown on Silicon