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Arvind Raj Mahankali Sridhar

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Publications associées (20)

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PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays

David Atienza Alonso, Marina Zapater Sancho, Arvind Raj Mahankali Sridhar, Mohamed Mostafa Sabry Aly, Artem Andreev, Bruno Michel

Integrated Flow-Cell Arrays (FCAs) represent a combination of integrated liquid cooling and on-chip power generation, converting chemical energy of the flowing electrolyte solutions to electrical energy. The FCA technology provides a promising way to addre ...

Institute of Electrical and Electronics Engineers2017

ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network

David Atienza Alonso, Arvind Raj Mahankali Sridhar

Microchannel liquid cooling has been proposed since the late 2000s as a viable enabler for 3D integration of microprocessors to continue scaling of computing power in the face of increasingly reduced returns from CMOS technology scaling. Thermal and electr ...

ACM/IEEE Press2015

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Integrated microfluidic power generation and power delivery promises to be a disruptive packaging technology with the potential to combat dark silicon. It essentially consists of integrated microchannel-based electrochemical “flow cells” in a 2D/3D multipr ...

IEEE/ACM Press2014

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Liquid-cooling using microchannel heat sinks etched on silicon dies is seen as a promising solution to the rising heat fluxes in two-dimensional and stacked three-dimensional integrated circuits. Development of such devices requires accurate and fast therm ...

Institute of Electrical and Electronics Engineers2014

A semi-analytical approach for optimized design of microchannel liquid-cooled ICs

David Atienza Alonso, Arvind Raj Mahankali Sridhar

The development of embedded and interlayer liquid cooling in integrated circuits (ICs) using silicon microchannels has gained interest in the recent years owing to the rise of on-chip heat uses that aggravate thermal reliability issues of the emerging 3D s ...

IEEE Press2014

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The soaring demand for computing power in our digital information age has produced as collateral undesirable effect a surge in power consumption and heat density for computing servers. Accordingly, 30-40% of the energy consumed in state-of-the-art servers ...

IEEE/ACM Press2014

A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Mohamed Mostafa Sabry Aly

While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchannel liquid cooling of 3D ICs also creates the problem of increased thermal gradients from the fluid inlet to outlet ports [1, 2]. These cooling-induced therma ...

Institute of Electrical and Electronics Engineers2014

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Ayse Kivilcim Coskun, Jie Meng

Liquid cooling using interlayer microchannels has appeared as a viable and scalable packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel-based liquid cooling, however, can substantially increase the on-chip thermal gradients, ...

Institute of Electrical and Electronics Engineers2013

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Two-phase liquid cooling of computer chips via microchannels etched directly on silicon dies is a potential long-term solution to enable continued integration of high-performance multiprocessors. Two-phase cooling refers to the heat removal via evaporation ...

IEEE/ACM Press2013

Thermal Simulation of Liquid-Cooled Integrated Circuits

Arvind Raj Mahankali Sridhar

Growing demands for increased functionality in consumer electronics and for information technology-enabled services in various sectors have resulted in the rise of high-performance multiprocessor system-on-chips (MPSoCs) and three-dimensionally stacked int ...

EPFL2013