Êtes-vous un étudiant de l'EPFL à la recherche d'un projet de semestre?
Travaillez avec nous sur des projets en science des données et en visualisation, et déployez votre projet sous forme d'application sur GraphSearch.
We describe a combination of 100-mm wafer scale deep-ultraviolet (DUV) exposure and a microelectromechanical systems (MEMS) process to fabricate silicon nitride membranes with submicrometer apertures to be used as miniature shadow masks or nanostencils. Apertures down to a lateral resolution of 200 nm were made in a 500-nm-thick membrane by DUV exposure and dry plasma etching. The membranes were released by a combination of wet silicon etching using potassium hydroxide (KOH) and dry silicon etching using a plasma process. The millimeter-size stencils were used for single-step, local deposition of metal micro- and nano-patterns without the need for photoresist process steps. We have performed stencil deposition on full wafer scale for micro- and nano-patterns in a variety of metals (e.g. Al, Au, Ni, etc.). Dry under-etching of the nanowires resulted in free-standing cantilevered nanoelectromechanical systems (NEMS) structures with resonance frequencies in the megahertz range. The resistless method allows us to pattern micrometer and nanometer scale patterns in a single step without any further processing. It is promising for the surface processing of MEMS/NEMS devices having sensitive or fragile surfaces, such as biochips, organic polymer layers, and self-assembled monolayers. (C) 2004 American Vacuum Society.
Chargement
Chargement
Chargement
Chargement
Chargement
Jürgen Brugger, Marc Antonius Friedrich van den Boogaart
Jürgen Brugger, Nao Takano, Marc Antonius Friedrich van den Boogaart
Jürgen Brugger, Nao Takano, Marc Antonius Friedrich van den Boogaart