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Wafer Level Fabrication of Vibrational Energy Harvesters using Bulk PZT Sheets

Publications associées (33)

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Epitaxial Piezoelectric MEMS on Silicon

Don Isarakorn

Integration of new functional materials into silicon microsystems is a key factor to enable technology for a wide range of innovative MEMS devices. Piezoelectric materials are of primary interest for integrating sensing and actuation functions in MEMS due ...

EPFL2011

Epitaxial piezoelectric MEMS on silicon

Nico de Rooij, Danick Briand, Pattanaphong Janphuang, Don Isarakorn

This paper reports on the microfabrication and characterization of piezoelectric MEMS structures based on epitaxial Pb(Zr0.2Ti0.8)O-3 (PZT) thin films grown on silicon wafers. Membranes and cantilevers are realized using a sequence of microfabrication proc ...

Institute of Physics2010

AIN Thin Film Structures for High-Q Resonators

Alvaro Artieda

The development of wireless and mobile communication in the last decade led to the elaboration of new components based on thin films with continually increasing performance and reduced fabrication cost. A fundamental element for mobile communication is the ...

EPFL2010

Micromachined tunable devices based on silicon integrated BaxSr1-xTiO3 thin films

Andreas Nöth

Thin Film Bulk Acoustic Wave Resonators (TFBARs) had been developed a decade ago and since then were implemented extensively in mobile communications devices. The "heart" of a TFBAR consists of a piezoelectric film that operates as an acousto-electric tran ...

EPFL2009

Nanogap MEM resonators on SOI

Nicoleta-Diana Ciressan

Today's consumer electronics based on a large variety of time-keeping and frequency reference applications is based on quartz-crystal oscillators, because of their excellent performances in terms of quality factor, thermal and frequency stability. However, ...

EPFL2009

High coupling materials for thin film bulk acoustic wave resonators

Janine Conde

Radio frequency (RF) filters based on bulk acoustic wave resonances in piezoelectric thin films have become indispensable components in mobile communications. The currently used material, AlN, exhibits many excellent properties for this purpose. However, i ...

EPFL2009

Copper / low-k technological platform for the fabrication of high quality factor above-IC passive devices

Modern communication devices demand challenging specifications in terms of miniaturization, performance, power consumption and cost. Every new generation of radio frequency integrated circuits (RF-ICs) offer better functionality at reduced size, power cons ...

EPFL2007

PZT thin film growth and chemical composition control on flat and novel three-dimensional micromachined structures for MEMS devices

Florian Calame

Piezoelectric micro-electro-mechanical systems (MEMS) are finding an increased interest for applications requiring high frequency operation and high mechanical quality. The aim of this work was to improve piezoelectric MEMS along two main research directio ...

EPFL2007

Friction based locomotion module for mobile MEMS robots

Reymond Clavel, Amar Rida, Jean-Marc Breguet, Walter Driesen

The “Modulated Friction Inertial Drive (MFID) principle” is presented as a locomotion solution for mmsize micro robots dealing with both size constraints and limitations in terms of power consumption. Based on one of the configurations of this locomotion p ...

2007

Nanostencil lithography for nanowire patterning

Jürgen Brugger, Marc Antonius Friedrich van den Boogaart

Stencil lithography is an innovative method for patterning that has a great flexibility from many points of view. It is based on shadow mask evaporation using thin silicon nitride membranes that allow the patterning of sub-100 nm features up to 100 μm in a ...

2006