Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Durcissement (électronique)Le durcissement des composants électroniques contre les rayonnements ionisants désigne un mode de conception, de réalisation et de test des systèmes et composants électroniques pour les rendre résistants aux dysfonctionnements et dégradations causés par des rayonnements électromagnétiques et les particules subatomiques énergétiques rencontrés lors des vols spatiaux ou en haute altitude, ainsi que dans l'environnement des réacteurs nucléaires, voire lors d'opérations militaires.
Transistor countThe transistor count is the number of transistors in an electronic device (typically on a single substrate or "chip"). It is the most common measure of integrated circuit complexity (although the majority of transistors in modern microprocessors are contained in the cache memories, which consist mostly of the same memory cell circuits replicated many times). The rate at which MOS transistor counts have increased generally follows Moore's law, which observed that the transistor count doubles approximately every two years.
Electrolytic capacitorAn electrolytic capacitor is a polarized capacitor whose anode or positive plate is made of a metal that forms an insulating oxide layer through anodization. This oxide layer acts as the dielectric of the capacitor. A solid, liquid, or gel electrolyte covers the surface of this oxide layer, serving as the cathode or negative plate of the capacitor. Because of their very thin dielectric oxide layer and enlarged anode surface, electrolytic capacitors have a much higher capacitance-voltage (CV) product per unit volume than ceramic capacitors or film capacitors, and so can have large capacitance values.
SDRAMSDRAM ou Synchronous Dynamic Random Access Memory (en français, mémoire dynamique synchrone à accès aléatoire) est un type particulier de mémoire vive dynamique ayant une interface de communication synchrone. Jusqu'à son apparition, les mémoires DRAM étaient asynchrones, cela signifie qu'elles n'attendaient pas un signal de l'horloge du bus pour réagir aux signaux d'entrée, donc qu'elles n'étaient pas synchronisées avec le bus.
Film capacitorFilm capacitors, plastic film capacitors, film dielectric capacitors, or polymer film capacitors, generically called film caps as well as power film capacitors, are electrical capacitors with an insulating plastic film as the dielectric, sometimes combined with paper as carrier of the electrodes. The dielectric films, depending on the desired dielectric strength, are drawn in a special process to an extremely thin thickness, and are then provided with electrodes.
Système sur une pucethumb|Puce ARM Exynos sur le smartphone Nexus S de Samsung. Un système sur une puce, souvent désigné dans la littérature scientifique par le terme anglais (d'où son abréviation SoC), est un système complet embarqué sur un seul circuit intégré (« puce »), pouvant comprendre de la mémoire, un ou plusieurs microprocesseurs, des périphériques d'interface, ou tout autre composant nécessaire à la réalisation de la fonction attendue.
Tantalum capacitorA tantalum electrolytic capacitor is an electrolytic capacitor, a passive component of electronic circuits. It consists of a pellet of porous tantalum metal as an anode, covered by an insulating oxide layer that forms the dielectric, surrounded by liquid or solid electrolyte as a cathode. Because of its very thin and relatively high permittivity dielectric layer, the tantalum capacitor distinguishes itself from other conventional and electrolytic capacitors in having high capacitance per volume (high volumetric efficiency) and lower weight.
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
CondensateurUn condensateur est un composant électronique élémentaire, constitué de deux armatures conductrices (appelées « électrodes ») en influence totale et séparées par un isolant polarisable (ou « diélectrique »). Sa propriété principale est de pouvoir stocker des charges électriques opposées sur ses armatures. La valeur absolue de ces charges est proportionnelle à la valeur absolue de la tension qui lui est appliquée.
