Publication

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Publications associées (96)

À propos
Confidentialité
Mentions légales

Graph Chatbot

Chattez avec Graph Search

Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.

AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.

Connectez-vous pour utiliser Chat avec Graph Search

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Graph Chatbot

Chattez avec Graph Search

Methods and systems for power-efficient inductive chip-to-chip communications

Optimisation of industrial production of low-force sensors – adhesive bonding of force-centring ball

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

Temperature-Aware Runtime Power Management for Chip-Multiprocessors with 3-D Stacked Cache

A semi-analytical approach for optimized design of microchannel liquid-cooled ICs

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration

3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Thermal Simulation of Liquid-Cooled Integrated Circuits

Optimisation of industrial production of low-force sensors – adhesive bonding of force-centring ball

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

Thermal Simulation of Liquid-Cooled Integrated Circuits

A semi-analytical approach for optimized design of microchannel liquid-cooled ICs

Temperature-Aware Runtime Power Management for Chip-Multiprocessors with 3-D Stacked Cache

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration

3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Methods and systems for power-efficient inductive chip-to-chip communications