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Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

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Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

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Methods and systems for power-efficient inductive chip-to-chip communications

Optimisation of industrial production of low-force sensors – adhesive bonding of force-centring ball

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

Temperature-Aware Runtime Power Management for Chip-Multiprocessors with 3-D Stacked Cache

A semi-analytical approach for optimized design of microchannel liquid-cooled ICs

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration

3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Thermal Simulation of Liquid-Cooled Integrated Circuits

Optimisation of industrial production of low-force sensors – adhesive bonding of force-centring ball

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Thermal Simulation of Liquid-Cooled Integrated Circuits

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration

A semi-analytical approach for optimized design of microchannel liquid-cooled ICs

Methods and systems for power-efficient inductive chip-to-chip communications

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

Temperature-Aware Runtime Power Management for Chip-Multiprocessors with 3-D Stacked Cache