Publication

A Chip-Level Post-CMOS Via-Last Cu TSV Process for Multi-Layer Homogeneous 3D Integration

Publications associées (34)

Graph Chatbot

Chattez avec Graph Search

Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.

AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.

Connectez-vous pour utiliser Chat avec Graph Search

The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias

Edoardo Charbon, Sandro Carrara, Simone Frasca, Rebecca Camilla Leghziel

We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturin ...

2021

Copper TSV-Based Process Development for Die-Level Homogeneous and Heterogeneous 3D Integration Platform

Seniz Esra Küçük

Research and development efforts on chip and wafer-scale 3D integration for system miniaturization have been continuing for more than a decade. However, there are still only a handful of 3D integrated products available in the market due to the high cost a ...

EPFL2017

, , , , , , ,

High-speed signaling over package substrates is key to delivering the promise of 2.5D integration. Applications abound and include high-density memory interfaces, sub-division of large dies to increase yield and lower development time, sub-division of a di ...

2016

3-D integrated circuits (3-D ICs) offer a promising solution to overcome the scaling limitations of 2-D ICs. However, using too many through-silicon-vias (TSVs) pose a negative impact on 3-D ICs due to the large overhead of TSV (e.g., large footprint and l ...

Institute of Electrical and Electronics Engineers2015

, ,

In this paper, a low temperature flip-chip integration technique for Si bare dies is demonstrated on flexible PET substrates with screen-printed circuits. The proposed technique is based on patterned blind vias in dry film photoresist (DP) filled with isot ...

Iop Publishing Ltd2015

Methods and systems for power-efficient inductive chip-to-chip communications

Mohammad Amin Shokrollahi, Harm Cronie

Digital information is communicated between stacked integrated circuit devices by inductive coupling between arrays of inductors formed from integrated circuit wiring layers. This can be done using a combination of push-pull drivers, common inductor return ...

2015

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration

Davide Sacchetto, Seniz Esra Küçük, Yusuf Leblebici, Clemens Benedict Nyffeler

In this work, a chip-level post-CMOS processing protocol for 3D integration is presented to achieve multilayer stacking. This protocol includes TSV formation on the top chip, bonding the chips on top of each other, and finally the electrical connection pro ...

2014

, , , ,

Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and t ...

American Society of Mechanical Engineers2014

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

Carlotta Guiducci, Yusuf Leblebici, Yüksel Temiz

This paper presents a chip-level postcomplementary metal oxide semiconductor (CMOS) processing technique for 3-D integration and through-silicon-via (TSV) fabrication. The proposed technique is based on dry-film lithography, which is a low-cost and simple ...

Ieee-Inst Electrical Electronics Engineers Inc2013

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

John Richard Thome, Michail Zervas, Yusuf Leblebici, Yassir Madhour, Bruno Michel

Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

IEEE2013