Design of Approximate Circuits by Fabrication of False Timing Paths: The Carry Cut-Back Adder

This paper introduces a novel method for designing approximate circuits by fabricating and exploiting false timing paths, i.e. critical paths that cannot be logically activated. This allows to strongly relax timing constraints while guaranteeing minimal and controlled behavioral change. This technique is applied to an approximate adder architecture, called the Carry Cut-Back Adder (CCBA), in which high-significance stages can cut the carry propagation chain at lower-significance positions. This lightweight approach prevents the logic activation of the carry chain, improving performance and energy efficiency while guaranteeing low worst-case errors. A design methodology is presented along with implementation, error optimization and design-space minimization. The CCBA is proven capable of extremely high accuracy while displaying significant circuit savings. For a worst-case precision of 99.999%, energy savings up to 36% are demonstrated compared to exact adders. Finally, an industry-oriented comparison of 32-bit approximate and truncated adders is carried out for mean and worst-case relative errors. The CCBA outperforms both state-of-the-art and truncated adders for high-accuracy and low-power circuits, confirming the interest of the proposed concept to help building highly-efficient approximate or precision-scalable hardware accelerators.

Design and Applications of Approximate Circuits by Gate-Level Pruning

Vincent Frédéric Camus, Christian Enz, Jérémy Lucien Maurice Schlachter

Energy-efficiency is a critical concern for many systems, ranging from Internet of things objects and mobile devices to high-performance computers. Moreover, after 40 years of prosperity, Moore's law is starting to show its economic and technical limits. Noticing that many circuits are over-engineered and that many applications are error-resilient or require less precision than offered by the existing hardware, approximate computing has emerged as a potential solution to pursue improvements of digital circuits. In this regard, a technique to systematically tradeoff accuracy in exchange for area, power, and delay savings in digital circuits is proposed: gate-level pruning (GLP). A CAD tool is build and integrated into a standard digital flow to offer a wide range of cost-accuracy tradeoffs for any conventional design. The methodology is first demonstrated on adders, achieving up to 78% energy-delay-area reduction for 10% mean relative error. It is then detailed how this methodology can be applied on a more complex system composed of a multitude of arithmetic blocks and memory: the discrete cosine transform (DCT), which is a key building block for image and video processing applications. Even though arithmetic circuits represent less than 4% of the entire DCT area, it is shown that the GLP technique can lead to 21% energy-delay-area savings over the entire system for a reasonable image quality loss of 24 dB. This significant saving is achieved thanks to the pruned arithmetic circuits, which sets some nodes at constant values, enabling the synthesis tool to further simplify the circuit and memory.

Ieee-Inst Electrical Electronics Engineers Inc2017

SOI mixed-mode design techniques and case studies

Marija Blagojevic

Since the emergence of Silicon On Insulator (SOI) technology the research activities have been concentrated on a detailed analysis of SOI devices and their use in different application fields (low-voltage, low-power circuits, high temperature electronics, digital circuits, etc.). The present thesis deals with low-voltage, low-power mixed-mode design using a SOI technology. The goal is to establish the concepts that allow one to design SOI mixed-mode circuits, and to apply these concepts to the design of fully depleted (FD) and partially depleted (PD) SOI circuits and systems. Two studies have been realized in the scope of this work: a Hall sensor based microsystem design using an experimental FD SOI technology a DRAM design using capacitor-less 1T floating-body PD SOI memory cells. At the beginning of this thesis, two major types of SOI devices are introduced, namely FD and PD devices. The most important properties of these devices are then presented and compared to those of CMOS bulk devices. A design methodology based on design retargeting from bulk to SOI technology is further proposed. This methodology is developed with the aim of being implemented for the design of FD SOI circuits. It consists in using the same device dimensions and bias currents for the bulk and the corresponding FD SOI design. The analysis performed proves that such an approach permits one to obtain better circuit performances using the FD SOI technology. The EKV model is chosen for Spice simulations. For that purpose the extraction of the EKV intrinsic parameters has been performed for the experimental 0.5 μm FD SOI technology. The EKV model card obtained from transistor measurements is implemented straightforwardly for circuit simulations. The first study presented in this thesis is an FD SOI Hall sensor front-end for energy measurement. The mixed-mode microsystem design is completely based on the proposed design methodology. The system level solutions are also included, such as the spinning-current method that serves for reduction of the offset and low frequency noise of the analog front-end, and a high resolution analog-to-digital conversion technique. The integrated microsystem is entirely functional. Furthermore, according to the existing literature, this integrated circuit is the first microsystem completely realized using FD SOI technology. The overall system error that is obtained is less than 1.5 %. During the second part of this work, a novel sensing scheme that exploits an automatic reference generation based on successive approximations has been developed for the PD SOI capacitor-less 1T DRAM. The 1T DRAM reference current is generated by an adjustable current source. The electrical calibration of the reference current is performed using a digital-to-analog converter and successive approximations algorithm. The proposed scheme is evaluated in a 2 kb test chip. The circuit integrated using PD SOI technology contains a 2 kb 1T memory array, as well as automatic reference generators and peripheral circuits. The automatic reference generator comprises current mode sense amplifier, M/3M converter, and successive approximations register. All blocks implemented in the test chip are described in detail, and PD SOI design issues are discussed. A number of experimental results demonstrate the potential of the PD SOI 1T DRAM for future embedded DRAM applications. The measured retention time under holding conditions is higher than 1s. In the continuous read mode, a few hundreds of the read cycles can be performed without a refresh operation. The test chip has a measured access time of 25 ns with a read cycle time of 70 ns.

EPFL2005

Signaling in 3-D integrated circuits, benefits and challenges

Somayyeh Rahimian Omam

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed.