A new interconnect-centric design methodology for high-speed standard cells with crosstalk immunity
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The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors and related integrated microprocessor systems in the architectural level. In the succession of years microprocessors are aiming towards lower power consumpti ...
The European project ECCOFLOW aims at a versatile resistive-type superconducting fault current limiter. For the first time, such a device will be tested at two different sites. The project partners have developed a superconducting fault current limiter des ...
Institute of Electrical and Electronics Engineers2013
The electronics industry is present nowadays in the most various applications. A new type of technology for integrated circuits named BCD has started to be developed and appeared from the mid 1980’s. This new technology allows integrating bipolar transisto ...
3D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. In 3DMI technology the 3D contacts, connecting different active layers, are in the order of few 100 nm. Given the advantage of ...
Lookup table-based FPGAs offer flexibility but compromise on performance, as compared to custom CMOS implementations. This paper explores the idea of minimising this performance gap by using fixed, fine-grained, non-programmable logic structures in place o ...
In three-dimensional (3D) integrated circuits, the effect of process variations on clock skew differs from 2D circuits. The combined effect of inter-die and intra-die process variations on the design of 3D clock distribution networks is considered in this ...
Despite many advantages of Field-Programmable Gate Arrays (FPGAs), they fail to take over the IC design market from Application-Specific Integrated Circuits (ASICs) for high-volume and even medium-volume applications, as FPGAs come with significant cost in ...
has already been proven that analog emulation overcomes the speed limits of numerical simulators by means of a simple fixed-topology prototype. In order to enhance the modularity and the size of the emulated power system a dedicated platform based on a fie ...
Nanosystems - based on the systematic application of nano-technologies - will create a large market of applications and a renewed perspective for electronic design and manufacturing companies. Such systems will be the fundamental building blocks of wearabl ...
Organosilicate glasses (OSGs) are used as low-k intermetal dielectrics for advanced integrated circuits. In this application, the material must fulfill two conflicting requirements: It has to have low density to reduce the dielectric constant while being s ...
