MEMS Packaging: Techniques and Considerations

In course

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Description

This lecture covers the packaging of Micro-Electro-Mechanical Systems (MEMS), including bonding techniques, levels of packaging, roles of a package, and major issues. It discusses wafer bonding, anodic bonding, thermo-compression bonding, glass frit, soldering, and adhesive glues for MEMS packaging.

Instructor

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Official source

https://mediaspace.epfl.ch/media/0_tey9cvmb

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Ontological neighbourhood

Computer engineering

Hardware engineering: Microprocessors

Business

Supply chain: Logistics

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