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In this thesis several advances are made to the emerging field of 3D printed mechanical sensors. Techniques and processes were developed to enable the integration of highly conductive, and capacitive and piezoresistive sensing features embedded within 3D p ...
EPFL2022
Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...
EPFL2016
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The pyroresistive response of conductive polymer composites (CPCs) has attracted much interest because of its potential applications in many electronic devices requiring a significant responsiveness to changes in external physical parameters such as temper ...