System in a packageA system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing components for mobile phones, digital music players, etc.
Network topologyNetwork topology is the arrangement of the elements (links, nodes, etc.) of a communication network. Network topology can be used to define or describe the arrangement of various types of telecommunication networks, including command and control radio networks, industrial fieldbusses and computer networks. Network topology is the topological structure of a network and may be depicted physically or logically. It is an application of graph theory wherein communicating devices are modeled as nodes and the connections between the devices are modeled as links or lines between the nodes.
Soft microprocessorA soft microprocessor (also called softcore microprocessor or a soft processor) is a microprocessor core that can be wholly implemented using logic synthesis. It can be implemented via different semiconductor devices containing programmable logic (e.g., ASIC, FPGA, CPLD), including both high-end and commodity variations. Most systems, if they use a soft processor at all, only use a single soft processor. However, a few designers tile as many soft cores onto an FPGA as will fit.
Standard cellIn semiconductor design, standard-cell methodology is a method of designing application-specific integrated circuits (ASICs) with mostly digital-logic features. Standard-cell methodology is an example of design abstraction, whereby a low-level very-large-scale integration (VLSI) layout is encapsulated into an abstract logic representation (such as a NAND gate). Cell-based methodology – the general class to which standard cells belong – makes it possible for one designer to focus on the high-level (logical function) aspect of digital design, while another designer focuses on the implementation (physical) aspect.
BroadcomBroadcom Inc. is an American multinational designer, developer, manufacturer, and global supplier of a wide range of semiconductor and infrastructure software products. Broadcom's product offerings serve the data center, networking, software, broadband, wireless, storage, and industrial markets. As of 2022, some 78 percent of Broadcom's revenue was coming from its semiconductor-based products and 22 percent from its infrastructure software products and services. Tan Hock Eng is the company's president and CEO.
AlteraAltera Corporation was a manufacturer of programmable logic devices (PLDs) headquartered in San Jose, California. It was founded in 1983 and acquired by Intel in 2015. The main product lines from Altera were the flagship Stratix series, mid-range Arria series, and lower-cost Cyclone series system on a chip field-programmable gate arrays (FPGAs); the MAX series complex programmable logic device and non-volatile FPGAs; Quartus design software; and Enpirion PowerSoC DC-DC power solutions.
Package on a packagePackage on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.
Ball grid arrayA ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
C to HDLC to HDL tools convert C language or C-like computer code into a hardware description language (HDL) such as VHDL or Verilog. The converted code can then be synthesized and translated into a hardware device such as a field-programmable gate array. Compared to software, equivalent designs in hardware consume less power (yielding higher performance per watt) and execute faster with lower latency, more parallelism and higher throughput.
I²CI2C (Inter-Integrated Circuit; pronounced as “”), alternatively known as I2C or IIC, is a synchronous, multi-master/multi-slave (controller/target), packet switched, single-ended, serial communication bus invented in 1982 by Philips Semiconductors. It is widely used for attaching lower-speed peripheral ICs to processors and microcontrollers in short-distance, intra-board communication. Several competitors, such as Siemens, NEC, Texas Instruments, STMicroelectronics, Motorola, Nordic Semiconductor and Intersil, have introduced compatible I2C products to the market since the mid-1990s.
