Plating | EPFL Graph Search

Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for radiation shielding, and for other purposes. Jewelry typically uses plating to give a silver or gold finish. Thin-film deposition has plated objects as small as an atom, therefore plating finds uses in nanotechnology. There are several plating methods, and many variations. In one method, a solid surface is covered with a metal sheet, and then heat and pressure are applied to fuse them (a version of this is Sheffield plate). Other plating techniques include electroplating, vapor deposition under vacuum and sputter deposition. Recently, plating often refers to using liquids. Metallizing refers to coating

Pulse plating of Ni-W alloys from model electrolytes

Dieter Landolt

Pulse plating of nickel-tungsten alloys has been studied from two citrate ammonia based model electrolytes containing either an excess of nickel or an excess of tungsten. The alloy composition and current efficiency were determined for pulse periods ranging from 1 ms to 50 s at a constant duty cycle of 0.4. Deposits were analysed by X-ray fluorescence and by gravimetry. In the nickel rich electrolyte the rate of co-deposition of tungsten was found to be controlled by mass transport as previously observed with Ni-Mo alloys. In the tungsten rich electrolyte the tungsten concentration in the deposited alloys was the highest at short pulse periods. This suggests that the deposition rate of tungsten was affected by the rate of transport of nickel which is the highest at short times. As the pulse on time exceeded the transition time for nickel the current efficiency for alloy deposition dropped owing to hydrogen formation.

2008

W-Band Waveguide Filters Fabricated by Laser Micromachining and 3-D Printing

Mathieu Billod, Emile Jacques de Rijk, Cheng Guo

This paper presents two W-band waveguide bandpass filters, one fabricated using laser micromachining and the other 3-D printing. Both filters are based on coupled resonators and are designed to have a Chebyshev response. The first filter is for laser micromachining and it is designed to have a compact structure allowing the whole filter to be made from a single metal workpiece. This eliminates the need to split the filter into several layers and therefore yields an enhanced performance in terms of low insertion loss and good durability. The second filter is produced from polymer resin using a stereolithography 3-D printing technique and the whole filter is plated with copper. To facilitate the plating process, the waveguide filter consists of slots on both the broadside and narrow side walls. Such slots also reduce the weight of the filter while still retaining the filter's performance in terms of insertion loss. Both filters are fabricated and tested and have good agreement between measurements and simulations.

Ieee-Inst Electrical Electronics Engineers Inc2016

'Green' Cr(iii)-glycine electrolyte for the production of FeCrNi coatings: electrodeposition mechanisms and role of by-products in terms of coating composition and microstructure

Enrico Bertero, Johann Michler, Stefano Mischler

The electrodeposition of stainless steel-like FeCrNi alloys for miniaturised devices is appealing as it would allow combining excellent material properties (e.g. corrosion resistance, hardness, biocompatibility) at low-cost. However, conventional baths often contain hazardous hexavalent chromium. Cr-based alloys electrodeposited from environmentally friendly trivalent chromium electrolytes are crucial for industrial application for facilitating the transition towards sustainable and ecological production and processing. Nevertheless, this process has not been comprehensively studied or understood in depth: especially the role of organic agents (common additives for improving Cr(iii)-based plating; e.g. glycine) in terms of material properties of the electrodeposits. The aim of this work was to investigate the electrodeposition of FeCrNi coatings from a 'green' Cr(iii)-glycine electrolyte. Novel information was attained by analysing films developed under various conditions and characterising them using a combination of advanced techniques. The evolution of microstructure (from amorphous to nanocrystalline) in correlation with film composition (i.e. metals ratio and presence of impurities) and elemental 3D spatial distribution was achieved for coatings produced from different anode materials and thermal post-treatment. The influence of Cr(iii) and glycine in terms of coating atomic contents (i.e. Fe-Cr-Ni-O-C-N-H) was evaluated for films in which both the applied current density and electrolyte composition were varied. These results, together with a thorough analysis on metals speciation/complexation allowed us to propose various Cr(iii)-based electroreduction mechanisms, and to observe, upon annealing, segregation and distribution of impurities, as well as of oxides and metals with respect to microstructure variation, providing an explanation for the amorphisation process.

ROYAL SOC CHEMISTRY2019

'Green' Cr(iii)-glycine electrolyte for the production of FeCrNi coatings: electrodeposition mechanisms and role of by-products in terms of coating composition and microstructure

Enrico Bertero, Johann Michler, Stefano Mischler

ROYAL SOC CHEMISTRY2019