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Explores the forces, tips, and probes used in Scanning Probe Microscopy, focusing on AFM principles, tip resolution limits, and cantilever probe fabrication.
Covers the process integration in semiconductor fabrication, including twin-well process, isolation methods, threshold voltage adjustment, and silicide formation.
Explores the fabrication of thin film devices for BCI, covering interconnect resistance, microfabrication, encapsulation materials, and Parylene coatings.
Explores stencil lithography, a high-resolution direct patterning technique, and its applications on flexible substrates, dynamic stenciling, and biopatterning.
