Concept

Parallel ATA

Related publications (32)

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Association of the Posterior Acromion Extension with Glenoid Retroversion: A CT Study in Normal and Osteoarthritic Shoulders

Alexandre Terrier, Alain Farron, Patrick Goetti, Frédéric Vauclair

Posterior eccentric glenoid wear is associated with higher complication rates after shoulder arthroplasty. The recently reported association between the acromion shape and glenoid retroversion in both normal and osteoarthritic shoulders remains controversi ...

MDPI2022

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A Nb3Sn based, React&Wind flat cable, named RW2, was developed in the past three years at the Swiss Plasma Center in the scope of the EUROfusion conceptual studies for DEMO. The test results presented earlier proved an excellent DC performance, but large e ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2021

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2021

TFHE: Fast Fully Homomorphic Encryption Over the Torus

This work describes a fast fully homomorphic encryption scheme over the torus (TFHE) that revisits, generalizes and improves the fully homomorphic encryption (FHE) based on GSW and its ring variants. The simplest FHE schemes consist in bootstrapped binary ...

SPRINGER2020

A system for predicting a likelihood of an occurrence of hallucinations in a subject including a master device configured to be at least one of moved, moved on, and manipulated by a subject, a slave device operably connected with the master device and adap ...

2018

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This research presents a transmission line model aimed for the fault location in power systems using a method based on the Electromagnetic Time-Reversal (EMTR). The discrete-time model simulates the waves travelling in the line by means of many unit delays ...

IEEE2018

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Four ITER main busbar (MB) conductor samples were tested in the SULTAN test facility (Centre de Recherches en Physique des Plasma, Ecole Polytechnique Fédérale de Lausanne, Switzerland) between 2011 and 2013. The MB conductors are NbTi-based cable-in-condu ...

2015

The increasing volume of time-based generated data and the shift in storage technologies suggest that we might need to reconsider indexing. Several workloads - like social and service monitoring - often include attributes with implicit clustering because o ...

2014

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Giovanni De Micheli, Yusuf Leblebici, Alessandro Cevrero, Giulia Beanato

3D-ICs based on TSV technology provide high bandwidth inter-chip connections. The drawback is that most of the existing TSVs consume a large amount of silicon real estate. We present circuit-level design and analysis of area efficient, low power, high-data ...

2014

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Giovanni De Micheli, Yusuf Leblebici, Alessandro Cevrero, Giulia Beanato

2014