Concept
Solder
Related lectures (35)
Soldering and Brazing: Fundamentals and Techniques
Covers soldering and brazing fundamentals, eutectic alloys, joint interfaces, fluxes, aluminum brazing challenges, and hybrid metal-ceramic parts.
Al-Cu System: Precipitation Hardening
Explores the precipitation hardening process in the Al-Cu system, focusing on how precipitates influence material properties.
Packaging of Intelligent Systems
Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.
Packaging of Intelligent Systems
Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.
Phase Diagrams: Understanding Phases and Transformations
Covers phase diagrams, transitions between phases, and the formation of microstructures in materials.
Structural Intermetallics: Basic Facts and Phases
Covers the formation, classes, and properties of intermetallic compounds, including specific examples like titanium aluminides, nickel aluminides, and iron aluminides.
Hexagonal Lattice in Mg Alloys
Covers the hexagonal lattice in Mg alloys, strengthening mechanisms, intermetallic structural alloys, and failure case analysis.
Chip Packaging Process Flow: Major Steps
Covers the major steps in chip packaging and the evolution of packaging technologies.
Structural Intermetallic Alloys
Explores the characteristics and properties of structural intermetallic alloys, including Laves phases, Hume-Rothery phases, and closed packed phases.
Making an Education: Hands-On Workshop Experience
Offers a hands-on workshop experience in soldering and circuit building, exploring the maker movement and STEM education.