Related lectures (32)
Soldering and Brazing: Fundamentals and Techniques
Covers soldering and brazing fundamentals, eutectic alloys, joint interfaces, fluxes, aluminum brazing challenges, and hybrid metal-ceramic parts.
Metal Carbonyls: Bonding
Covers the bonding in metal carbonyls and the Mond process for nickel purification.
Packaging of Intelligent Systems
Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.
Mechanical Systems: Assembly Techniques
Explores assembly techniques in mechanical systems, covering bolted joints, brazing, welding, and gluing, as well as the principles of tightening nuts and self-locking in screw-nut assemblies.
Making an Education: Hands-On Workshop Experience
Offers a hands-on workshop experience in soldering and circuit building, exploring the maker movement and STEM education.
Introduction and Definitions: Seminar Topics
Introduces assembly techniques, covering joining technology, welding processes, joint functionality, and classification of joints.
Laser Materials Processing: Drilling and Cutting
Explores laser welding, soldering, deep welding, joint geometries, drilling, and cutting techniques.
Packaging of Intelligent Systems
Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.
Chip Packaging Process Flow: Major Steps
Covers the major steps in chip packaging and the evolution of packaging technologies.
Assembly: Physics of Manufacturing
Explores assembly processes, labor costs, joining methods, and automation challenges in manufacturing.

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