Advanced MEMS Packaging

This lecture covers advanced techniques in MEMS packaging, including through-hole packages, ball grid arrays, flip-chip technology, surface mount packages, chip on board solutions, chip scale packaging, and failure analysis due to thermal stress and CTE mismatch. It also discusses microelectronic packaging components, such as die attach methods, soldering processes, and materials used. The instructor presents case studies of accelerometers and pressure sensors, highlighting the importance of careful gluing processes and material selection. Additionally, the lecture explores wafer-level packaging techniques, such as flip chip soldering and adhesive bonding, for MEMS devices, emphasizing the significance of hermetic sealing and stress control.