Sputtering: Film Growth and Control Parameters

This lecture explains the sputtering process, where atoms are ejected from a target and deposited onto a substrate at high pressure, impacting film quality. It covers the influence of parameters like voltage, pressure, temperature, and distance between electrodes on film adhesion, deposition rate, and contamination. Sputtering offers advantages over thermal evaporation, such as stability, versatility in material deposition, good adhesion, and compatibility with large-scale production processes.